Unlock instant, AI-driven research and patent intelligence for your innovation.

Method for tracing wafer boundary

A boundary and wafer technology, applied in the field of wafer boundary search, can solve problems such as trouble, excessive air cutting of the blade 201, and affecting production efficiency, etc.

Inactive Publication Date: 2003-03-26
TRUTEK CORP
View PDF0 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1. In order to avoid missing cutting of the fragmented wafer 101, the operator usually chooses a value larger than the actual size of the fragmented wafer 101 for the reference cutting dimensions L1 and L2. This often causes the blade 201 to produce excessive Empty cutting wastes a lot of time on ineffective cutting. When the unit chip size is smaller (such as 0.2mm×0.2mm LED chip), the air cutting is more time-consuming, which seriously affects the overall production efficiency.
[0006] 2. Because the shape and size of each broken wafer are different, the operator must repeatedly measure the cutting reference size of each broken wafer and repeatedly change the input of the wafer cutting machine 100 when cutting each time. Setting, in this way, is not only troublesome, but also affects production efficiency

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for tracing wafer boundary
  • Method for tracing wafer boundary
  • Method for tracing wafer boundary

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] A preferred embodiment of the method for finding wafer boundaries in the present invention is used in conjunction with the cutting machine 100, and in this embodiment, a wafer automatic alignment procedure is performed first, and then the steps of the present invention are performed, but , this embodiment does not limit the scope of application of the present invention.

[0036] see Figure 5, the pre-work of the wafer automatic alignment procedure is to first place a master wafer 10 on the cutting table 1, then the image of the master wafer 10 can be passed through a lens 301 of the camera 3 The analog / digital converter 401, the image storage device 402 and the central processing unit 4 are displayed in a window 501 of the display 5, and the master wafer 10 is formed with several separable The unit chip 11, the unit chip 11 has a first cutting direction y and a second cutting direction x, and is arranged in an array, and there is a cutting line 12 between each other, ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The method can be applicable to the cutting machine. The camera goes up, right and left to take picture and store the image of the fragment of wafer. The said image is compared with the chip of the master sample in order to obtain the upper boundary to cut. In a similar way, the low, left and right boundaries of the fragment of wafer can be determined accurately.

Description

【Technical field】 [0001] The invention relates to a method for searching the wafer boundary, in particular to a method for searching the wafer boundary which can accurately and automatically search the wafer boundary. 【Background technique】 [0002] Asia is now an important area of ​​the world's chip foundry. However, with the increasingly fierce global competition, how to complete and deliver products to customers in the most efficient way has become a very important issue. [0003] There is a wafer cutting machine 100, as shown in Figures 1, 2 and 3, the cutting machine 100 has a cutting table 1 that can move left and right along the X-axis direction, and can rotate around the Z-axis direction, for placing A wafer (the wafer is a broken wafer 101), a set of cutter shaft 2 and camera 3 that can move back and forth synchronously along the Y-axis direction, and the cutter shaft 2 can move up and down independently along the Z-axis direction, and is provided with a Blade 201,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B28D1/22H01L21/304
Inventor 徐秋田
Owner TRUTEK CORP