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Method for tracing wafer boundary

A boundary and wafer technology, applied in the field of wafer boundary search, can solve problems such as affecting production efficiency, trouble, excessive air cutting of the blade 201, etc.

Inactive Publication Date: 2005-04-27
TRUTEK CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] 1. In order to avoid missing cutting of the fragmented wafer 101, the operator usually chooses a value larger than the actual size of the fragmented wafer 101 for the reference cutting dimensions L1 and L2. This often causes the blade 201 to produce excessive Empty cutting wastes a lot of time on ineffective cutting. When the unit chip size is smaller (such as 0.2mm×0.2mm LED chip), the air cutting is more time-consuming, which seriously affects the overall production efficiency.
[0006] 2. Because the shape and size of each broken wafer are different, the operator must repeatedly measure the cutting reference size of each broken wafer and repeatedly change the input of the wafer cutting machine 100 when cutting each time. Setting, in this way, is not only troublesome, but also affects production efficiency

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  • Method for tracing wafer boundary

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Embodiment Construction

[0036] A preferred embodiment of the method for finding the wafer boundary of the present invention is used in conjunction with the cutting machine 100, and in this embodiment, an automatic wafer alignment procedure is performed first, and then the steps of the present invention are performed. The embodiment does not limit the scope of application of the present invention.

[0037] See Figure 5 , The pre-operation of the automatic wafer alignment procedure is to first place a mother wafer 10 on the cutting table 1, then the image of the mother wafer 10 can be passed through a lens 301 of the camera 3 The analog / digital converter 401, the image storage device 402, and the central processing unit 4 are displayed in a window 501 of the display 5, and a plurality of dicable and separable chips are formed on the mother chip 10 The unit chips 11 each have a first cutting direction y and a second cutting direction x, and are arranged in an array, and there is a dicing lane 12 therebetwee...

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Abstract

The method can be applicable to the cutting machine. The camera goes up, right and left to take picture and store the image of the fragment of wafer. The said image is compared with the chip of the master sample in order to obtain the upper boundary to cut. In a similar way, the low, left and right boundaries of the fragment of wafer can be determined accurately.

Description

【Technical Field】 [0001] The present invention relates to a method for searching the boundary of a wafer, in particular to a method for searching the boundary of a wafer that can accurately and automatically search for the boundary of a wafer. 【Background technique】 [0002] The Asian region is now an important area for wafer generation processing in the world. However, with the increasingly fierce global competition, how to complete products and deliver them to customers in the most efficient manner has become a very important topic. [0003] There is a wafer cutting machine 100, as shown in Figures 1, 2, and 3. The cutting machine 100 has a cutting table 1 that can move left and right along the X axis and can rotate around the Z axis for placement A wafer (the wafer is a fragmented wafer 101), a set of knife shaft 2 and camera 3 that can move back and forth in the Y-axis direction synchronously, and the knife shaft 2 can move up and down in the Z-axis direction independently, a...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D1/22H01L21/304
Inventor 徐秋田
Owner TRUTEK CORP