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Touch panel and its making process

A touch panel and substrate technology, applied in the direction of instruments, electrical digital data processing, electrical components, etc., can solve the problems of larger TTP dimensions and difficulties in miniaturization

Inactive Publication Date: 2003-05-14
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, the external dimensions of the TTP become larger, making miniaturization difficult. Therefore, there are problems in achieving miniaturization and cost reduction in conventional TTPs.

Method used

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  • Touch panel and its making process
  • Touch panel and its making process
  • Touch panel and its making process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0012] The following uses the embodiment of the present invention Figure 1 ~ Figure 3 Be explained. These figures are schematic and do not represent positions to scale.

[0013] (Example)

[0014] figure 1 is a cross-sectional view of a TTP according to an embodiment of the present invention.

[0015] Under the transparent upper substrate 100, a transparent upper conductive layer 200 is formed. The upper substrate 100 is made of a transparent film such as polyethylene terephthalate or polycarbonate. The upper conductive layer 200 is formed by a transparent conductive material, such as indium tin oxide and tin oxide, by vapor deposition and sputtering.

[0016] In addition, a conductive paste such as silver or carbon is printed on both ends of the upper conductive layer 200 on the pair of upper electrodes 700 .

[0017] Then, a transparent lower conductive layer 400 is formed on the upper surface of the transparent lower substrate 300 made of glass, acrylic resin, polyc...

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PUM

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Abstract

The present invention provides an inexpensive touch panel securing a predetermined active area and yet being downsized. The touch panel includes an upper substrate having an upper conductive layer beneath its lower face, and a lower substrate having a lower conductive layer on its upper face opposite to the upper conductive layer at a given interval. Pressing and heating a adhesive layer made from thermoplastic resin and hardener allows bonding the upper and lower substrates together. The touch panel is thus constructed.

Description

technical field [0001] The present invention relates to a touch panel for operating various electronic devices and a manufacturing method thereof. Background technique [0002] In recent years, with the high performance and diversification of electronic equipment, there has been an increase in the number of equipment with a transparent touch panel (hereinafter referred to as TTP) mounted on the front of display elements such as LCDs. Characters, symbols, patterns, etc. displayed on the display element are recognized and selected through this TTP. Then switch the various functions of the device by operating TTP. Such a conventional TTP is disclosed in JP-A-4-123728. [0003] Figure 4 It is a cross-sectional view of a conventional TTP. This TTP is formed by laminating an insulating substrate (such as a polyester film, etc.) 10 forming an upper electrode 20 and another insulating substrate (such as a glass plate, etc.) 30 forming a lower electrode 40 via a spacer 50 . Mult...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F3/033G06F3/045
CPCG06F3/045C09K2323/05Y10T428/24793
Inventor 松本贤一田边功二福井俊晴高畠谦一仁保贤二
Owner PANASONIC CORP