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Semiconductor integrated circuit having on-chip termination

An integrated circuit and semiconductor technology, applied in the field of semiconductor integrated circuits, can solve problems such as signal reflection

Inactive Publication Date: 2004-03-31
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The remaining bus leads to signal reflections

Method used

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  • Semiconductor integrated circuit having on-chip termination
  • Semiconductor integrated circuit having on-chip termination
  • Semiconductor integrated circuit having on-chip termination

Examples

Experimental program
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Embodiment Construction

[0019] Below, refer to the attached figure 1 A semiconductor integrated circuit according to an exemplary embodiment of the present invention will be described in detail.

[0020] Such as figure 1 As shown, the semiconductor integrated circuit 100 includes a bonding pad 101, a mode register set (MRS, mode register set) 110, an internal circuit 120, an output driver (or output buffer) 130, an output impedance control circuit 140, a termination impedance circuit 150 and Termination circuit 160 . The pads 101 are electrically connected to a bus 102 for transmitting signals. The output driver 130 is connected to the pad 101 and drives a signal from the internal circuit 120 to the pad 101 . Termination circuit 160 is connected to pad 101 to terminate bus 102 . Although in figure 1 Not shown in , it should be understood that other output drivers corresponding to other pads may also be provided. In this case, a termination circuit 160 is to be connected to each pad.

[0021] O...

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PUM

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Abstract

A semiconductor integrated circuit includes at least one pad coupled to a bus line, a transmitter for transmitting a signal from an internal circuit to the outside through the pad, and a termination circuit for terminating the bus line. The transmitter and the termination circuit are disposed to surround the pad, reducing a size of the semiconductor integrated circuit.

Description

technical field [0001] The present invention relates to a semiconductor integrated circuit, and more particularly to a semiconductor integrated circuit having a bus termination circuit for terminating a bus. Background technique [0002] In order to suppress signal reflections caused by integrated circuit devices on the receiver or sender side, termination resistors used in different integrated circuit devices (such as microprocessors, chipsets, memories, memory controllers, graphics controllers) can be terminated by termination resistors. ) to send signals between the buses. Signal reflections negatively affect signal integrity. Specifically, in systems supporting high-speed computing, signal reflections more negatively affect signal integrity. Therefore, the bus used for sending signals must be terminated. In general, a terminating resistor should be provided to the bus, which should be as close as possible to the integrated circuit device in order to suppress signal re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G11C5/02H04L25/02
CPCH04L25/0278H04L25/028H04L25/0292G11C5/02
Inventor 姜昌万朴润植
Owner SAMSUNG ELECTRONICS CO LTD