Flip-chip bonding package structure of chip

Abstract

This invention relates to a flip-chip bonding packaging structure including a chip and a baseplate, the welding points on the chip are corresponding to the welding disks on the baseplate and welded together characterizing that the shapes of the chip welding points are expanded steadily from the center to outside and shapes of the disks are expanded from center to outside coherently, the surrounding welding points of the chip are rectangular, same with the extending line radially from the center to outside and shapes of the surrounding disks are rectangular same with the extension line radially from center to outside, their shape can be elliptic.

Description

technical field [0001] The invention relates to integrated circuit packaging technology, in particular to a chip flip-chip packaging structure. Background technique [0002] The flip chip (Flip Chip) process is an advanced packaging technology used to replace the commonly used wire bonding (wire bonding) process for chip and external electrical interconnection. Its advantage lies in its good electrical performance, which is suitable for the application of high-speed and high-density electronic devices. Figure 1 shows the flow chart of this flip chip technology. [0003] As shown in Figure 1, the general flow of the flip chip technology is: [0004] On the side of the substrate layer 100 to the pad 101, the flux is dripped through the drip nozzle 110 to form a flux layer 120 on the surface of the substrate layer 100; (as shown in Figure 1A) [0005] Then, the chip 130 to be packaged is turned upside down on the substrate layer 100, so that the solder joints 131 on the chip...

AI Technical Summary

Problems solved by technology

[0010] The shortcoming of this kind of flip-chip welding is that: the shape of the solder joint 131 on the chip 130 and the shape of the pad 101 on the substrate layer 100 are mostly in the shape of a circle, and no matter the solder joint or the solder joint at the central position or the edge position Disks, which are uniform in shape and size

However, due to the different thermal expansion coefficients of the chip 130 and the organic substrate layer 100, the reliability of the solder joints decreases due to thermal mismatch during the manufacturing process and operation of the device.

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