Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Optical disk drive apparatus

A technology of optical disc drive and optical pickup device, which is applied in the direction of coupling device, optical recording head, optical head manufacturing, etc., can solve the problems of inability to insert flexible substrate into connectors, strict thickness restrictions, etc. Effect

Inactive Publication Date: 2006-08-23
HITACHI MEDIA ELECTORONICS CO LTD
View PDF3 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] In addition, the prior art of the above-mentioned Patent Document 3 is effective for an optical pickup device with a margin of thickness, but for a so-called thin optical pickup device whose thickness is reduced, the thickness restriction is strict, so that it cannot be used in the optical pickup device. Problems with inserting connectors on flexible substrates in devices

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Optical disk drive apparatus
  • Optical disk drive apparatus
  • Optical disk drive apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0065] First, referring to the first embodiment of the method of connecting the first flexible substrate 2-a and the second flexible substrate 2-b according to the present invention Figure 6 Be explained.

[0066] Figure 6 It is a flowchart showing a schematic manufacturing process of the optical pickup device according to the present invention.

[0067] The general manufacturing process of the optical pickup device includes: the step S41 of punching out the flexible substrate from the base material purchased in the form of a sheet; The process S42 of fixing the LSI chip component with a soldering material such as solder paste on a, and then electrically connecting and mounting the LSI chip component to the first flexible substrate 2-a through a reflow operation; The step S43 of soldering and connecting the secondary flexible substrate connecting the light-emitting element or the light-receiving element to the predetermined first flexible substrate 2-a on the pick-up devic...

Embodiment 2

[0080] For the second example of the method of connecting the first flexible substrate 2-a and the second flexible substrate 2-b according to the present invention Figure 8 illustrate. Figure 8 It is a figure which shows 2nd Example. In Embodiment 2, the difference from the first embodiment is that the first flexible substrate 2-a and the second flexible substrate 2-b are connected on opposite sides with respect to the height direction of the optical pickup device, The metal protective cover 4 attached and fixed to the case 3 has a structure in which the first flexible printed circuit 2-a is fixed. Have again, when this structure LSI chip is not installed on the metal protective cover 4 side, and when being installed on the housing 3 side of the optical pickup, if adopting the solder plating of the same side as the installation of the LSI in the connection, because Solder plating only needs to be done on one side, so the cost can be reduced.

Embodiment 3

[0082] Next, the method for connecting the first flexible substrate 2-a and the second flexible substrate 2-b according to the present invention will be described for the third embodiment. Figure 9 Be explained. Figure 9 It is a figure which shows 3rd Example. In the third embodiment, the difference from the first and second embodiments is that the connection end is bent in the height direction (vertical direction) of the optical pickup device and overlapped and connected in the horizontal direction, which is used in the housing for the optical pickup The structure in which the vertical part of the lower protective cover 4-1 made of metal installed and fixed on the inner side of 3 is pressed is effective when the restriction in the height direction is severe. Furthermore, in the third embodiment, the connecting end of the first flexible substrate may be bent in advance, and the optical pickup case 3 may be connected to the connecting end of the second flexible substrate by ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
dragaaaaaaaaaa
Login to View More

Abstract

In order to improve reliability of an optical disk drive apparatus at low cost, a flexible substrate for making connection between an optical pick-up device incorporated in the optical disk drive apparatus and a drive side is divided into a first flexible substrate fixed to the optical pick-up body (for example, upper surface), and a second flexible substrate connected to the first flexible substrate and extending to the drive, wiring conductors formed on a connection end portion of the first flexible substrate and wiring conductors formed on a connection end portion of the second flexible substrate are superposed at a region adjacent an end of the case of the optical pick-up device body, and connected to each other by joining material, and a connection section between the wiring conductors is held down by a cover for protecting the optical pick-up device body.

Description

technical field [0001] The invention relates to a thin optical pick-up device used for reproducing and recording optical discs such as CD (Compact Disc) or DVD (Digital Versatile Disc) and an optical drive device equipped with the thin optical pick-up device. Background technique [0002] Conventional technologies related to an optical disk drive device and an optical pickup incorporated therein are described in, for example, JP-A-8-96390 (Patent Document 1) and JP-A-9-320078 (Patent Document 2). [0003] Patent Document 1 describes that the return beam from the surface of the optical disc is received by a photodetector (light-receiving element), and the output signal from the photodetector is taken out externally and supported in a biaxial actuation controlled by an external drive. In the optical pickup section on the optical pickup, the flexible substrate arranged on the side of the optical pickup body and the flexible substrate connected to the flexible substrate transmit...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G11B7/08G11B21/16H01R12/26H01R12/78
CPCH05K1/147H05K2201/0191G11B7/22G11B7/08582
Inventor 荒井聪古市浩朗大关良雄外川英男佐竹光雄伊藤和彦渡边正义
Owner HITACHI MEDIA ELECTORONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com