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Partition device and alignment method for wafer

A wafer and alignment mechanism technology, applied to fine working devices, electrical components, circuits, etc., can solve the problems of reduced productivity and long time, and achieve the effect of improving productivity

Active Publication Date: 2007-03-28
DISCO CORP
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

In this method, it takes a relatively long time until the correction angle is obtained, resulting in a decrease in productivity.

Method used

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  • Partition device and alignment method for wafer
  • Partition device and alignment method for wafer
  • Partition device and alignment method for wafer

Examples

Experimental program
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Embodiment Construction

[0027] A cutting device 1 shown in FIG. 1 is a type of dividing device having a function of dividing a workpiece, and holds a workpiece on a chuck table 2 . The cutting mechanism 3 as a processing mechanism acts on the workpiece to cut it.

[0028] As shown in FIG. 2, on the surface of the workpiece, that is, the wafer W, a first planned separation line S1 and a second planned separation line S2 are formed orthogonally, and are divided by the first planned separation line S1 and the second planned separation line S2. And several devices D are formed. The wafer W is attached to a small piece of tape T, and the ring-shaped frame F is attached to the outer peripheral portion of the small piece of tape T, and the wafer W is integrally supported by the small piece of tape T and the frame F. .

[0029] A plurality of wafers W integrated with the frame F by the tape T in this way are housed in the wafer cassette 40 shown in FIG. The cassette mounting table 4 can be raised and lowe...

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Abstract

The subject of this invention is to improve the productivity by efficiently conducting an operation of conforming separation lines and the moving direction of a chuck table to each other, at the time of separating a wafer held by the chuck table into individual devices by processing the separation lines formed in the wafer. Besides a linear scale 334 for recognizing the positional information of an alignment means 8 for detecting the separation lines, another linear scale 224 for recognizing the positional information of the chuck table 2 is set up in the moving direction of the chuck table 2. Using the readings of both of the linear scales 334 and 224, the direction of the wafer is corrected so that the separation lines and the moving direction of the chuck table 2 may conform to each other.

Description

technical field [0001] The present invention relates to a dividing device having a function of dividing a workpiece such as a semiconductor wafer. Background technique [0002] As shown in FIG. 11, the wafer W divided by the first planned separation line S1 and the second planned separation line S2 formed vertically and horizontally, and formed into a plurality of devices D such as ICs and LSIs, is cut to make each planned separation line S1 and S2 are separated to be divided into individual devices D. For example, the cutting blade 32 rotating at high speed cuts into the first planned separation line S1 on the wafer W held by the chuck table 2 moving in the X-axis direction, and the first planned separation line S1 is separated by cutting. , cutting is performed after aligning (aligning) the cutting blade 32 with the first planned separation line S1. [0003] The cutting apparatus is equipped with an alignment mechanism 8 that uses an imaging unit 80 to image the surface ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/00H01L21/78H01L21/68
Inventor 根岸克治佐胁悟志
Owner DISCO CORP
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