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Cutting device

A technology of cutting devices and cutting knives, which is applied to fine working devices, stone processing equipment, manufacturing tools, etc., and can solve problems such as flying

Active Publication Date: 2007-05-23
DISCO CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, according to the experience of the inventors of the present invention, even if the partition wall device as described above is provided, there are cutting fluid and / or gaps between the sealing member and the partition wall and between the sealing member and the guide frame. Or the tendency of fine chips to move through the partition and fly to the lifting and moving mechanism and the moving mechanism

Method used

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Embodiment approach

[0015] Referring to FIG. 1 , the cutting device has a spindle housing 2 extending substantially horizontally. The main shaft sleeve 2, which may be cylindrical, is mounted to move up and down in a substantially vertical direction (vertical direction in FIG. 1 ) and freely move in a direction in which it extends (left-right direction in FIG. 1 ). The cutting device also has an elevating movement mechanism 4 for moving the main shaft sleeve 2 up and down, and a moving mechanism 6 for moving the main shaft sleeve 2 in its extending direction. The installation method of the main shaft sleeve 2 and the lifting and moving mechanism 4 and the moving mechanism 6 can be, for example, the methods disclosed in the above-mentioned Japanese Patent Application Publication No. 2002-103177, so the specific description refers to the above-mentioned Japanese Patent Application Publication No. 2002-103177, which is omitted in this specification. Explanation is briefly indicated by a two-dot dash...

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Abstract

A cutting device comprises: a substantively horizontal extending main shaft sleeve; a main shaft fixed in the main shaft sleeve; a cutting edge fixed on the top of the main shaft; a rotation driven device for driving the rotation main shaft; a lifting moving device for lifting the main shaft sleeve; a moving device for moving the main shaft sleeve; a cutting fluid supply device for supplying cutting fluid to the cutting edge. The bulkhead device comprises: a bulkhead extending in upright direction; a guide frame prescribing the guide space between the bulkheads; a sealing part in the guide space; wherein the sealing part is provided with openings having the same shape with the cross section of the main shaft sleeve, the main shaft sleeve passes through the bulkhead, the guide frame and the opening of the sealing part, the sealing part corresponding the lifting moving of the main shaft sleeve also executes lifting moving. The bulkhead is provided with at least one of the upper sloping side declining extending downwards toward the forwards from the opening upper limb, and the bottom sloping side declining extending upwards toward the rearwards from the opening bottom limb.

Description

technical field [0001] The present invention relates to a cutting device which completes the cutting of a workpiece by the cutting blade while supplying cutting fluid to a rotationally driven cutting blade. Background technique [0002] Japanese Unexamined Patent Publication No. 2002-103177 discloses a cutting device which is suitable for dicing semiconductor wafers. The cutting device involved has: a main shaft sleeve extending substantially in the horizontal direction; a main shaft rotatably installed in the main shaft sleeve, extending substantially horizontally and extending forward beyond the main shaft sleeve at the top; a cutting tool mounted on the the top end of the main shaft; the rotary driving device for rotating the main shaft; the lifting and moving mechanism for moving the main shaft sleeve up and down in a substantially vertical direction; the moving mechanism for moving the main shaft sleeve in its extending direction; the cutting fluid supply device, It is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/02
Inventor 福冈武臣中间祐司
Owner DISCO CORP
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