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Heat conducting paste and electronic device with the heat conducting paste

A technology of thermal conductive paste and polysiloxane, which is applied in the field of electronic devices and thermal conductive paste, and can solve the problems of bad heat dissipation of electronic components, oil spillage of thermal conductive paste, low thermal resistance, etc.

Inactive Publication Date: 2007-06-27
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Among the existing thermal interface materials, thermal paste is widely used due to its low thermal resistance. However, under long-term use, thermal paste will cause oil spillage, which will adversely affect the heat dissipation of electronic components.

Method used

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  • Heat conducting paste and electronic device with the heat conducting paste
  • Heat conducting paste and electronic device with the heat conducting paste
  • Heat conducting paste and electronic device with the heat conducting paste

Examples

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Embodiment Construction

[0009] Further description is made below in conjunction with embodiment with reference to accompanying drawing:

[0010] As shown in Figure 1, the electronic device 10 using thermal paste includes a heat-generating electronic component 12 disposed on a circuit board 11, a heat-dissipating element 13 for dissipating heat from the heat-generating electronic component 12, and filling the heat-generating electronic component 12 and the heat-generating electronic component 12. Thermal paste 14 between heat dissipation elements 13 . The heat dissipation element 13 includes a substrate 131 and a plurality of heat dissipation fins 133 disposed on the substrate 131 . The heat dissipation element 13 is fixed on the circuit board 11 through a fixing element 15, and the heat conduction paste 14 is pressed down, so that the heat conduction paste 14 is fully filled in the gap between the heat generating electronic element 12 and the substrate 131 of the heat dissipation element 13, reducing...

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Abstract

The heat conducting paste filled between exothermic electronic element and its heat sinking element consists of matrix in 8-11 wt% and heat conducting filler in 89-92 wt%. The matrix includes at least one of hydrogen-containing polyorganosiloxane and alkenyl group-containing polyorganosiloxane. The heat conducting paste with reactive silicone oil as the matrix has less oil overflow.

Description

【Technical field】 [0001] The invention relates to a heat conduction paste and an electronic device using the heat conduction paste. 【Background technique】 [0002] In order to solve the heat dissipation problem of the heating electronic components, people usually install heat dissipation elements such as radiators on the upper part of the heating electronic components, and dissipate the heat generated by the heating electronic components through the larger heat dissipation area of ​​the heat dissipation elements. [0003] In order for the cooling element to quickly dissipate the heat generated by the heating electronic component, there must be good heat transfer between the heating electronic component and the cooling component, that is, there should be a small contact thermal resistance between the heating electronic component and the cooling component. However, Due to the limitations of production conditions and production costs, the contact surface of the heating electron...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/08H01L23/42
CPCH01L2224/16225H01L2224/73253H01L2924/181H01L2924/00012
Inventor 郑景太郑年添
Owner FU ZHUN PRECISION IND SHENZHEN