Device with programmable scan chain for use in multi-chip assembly and programming method therefor

Abstract

The planning scanning chain device comprises a scanning chain with scanning input and output, several No. 1 input or output, input selector, selecting one of the input or output, coupling with the scanning input, several No. 2 input and output end, an output selector, selecting one of the No. 2 output or input with coupled scanning output. The planning scanning chain device comprises a scanning chain with scanning input and output, several No. 1 input or output, input selector, selecting one of the input or output, coupling with the scanning input, several No. 2 input and output end, an output selector, selecting one of the No. 2 output or input with coupled scanning output.

Description

technical field [0001] The present invention relates to the technology of flexible programmable scan chains applied to integrated circuit design, in particular, to a device with programmable scan chains (Programmable Scan Chains) applied to multi-chip modules and a programming method thereof. Background technique [0002] In the field of application-specific integrated circuit (Application-Specific Integrated Circuit) design, especially the integrated circuit design with a number of up to millions of transistor elements (gate-count), in order to facilitate mass production efficiency, it usually supports design for test (Design for Test) , which can be referred to as the DFT function for short. Please refer to FIG. 1 , which shows a block diagram of a chip with DFT function. Reference numeral 100 represents a chip, reference numerals 102A, 102B, ..., 102N represent scan chains, and reference numerals 104A, 104B, ..., 104N represent scan chains. Input ports (scan input ports)...

AI Technical Summary

Problems solved by technology

However, although each chip of the multi-chip module has a scanning input / output port, it cannot be bonded out because of the inter-connection between the chips, so that the existing scanning Chains cannot be tested in the component phase, leading to problems with poor test coverage

In response to such problems, some additional functional tests are added to compensate for the aforementioned poor test coverage, but this increases the cost of testing and often fails to achieve the expected coverage

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