Wire bonding method, semiconductor chip, and semiconductor package

Abstract

A method of wire bonding, a semiconductor chip, and a semiconductor package provides stitch-stitch bonds of a wire on a bond pad of a chip as well as on a bond position of a substrate. A ball-stitch bump is formed on an end of the wire extending from a capillary or provided on the bond pad of the chip. A ball-stitch bump is formed on the bond pad of the chip by pressing down the ball of the wire on the bond pad. A ball-stitch stitch bond of the wire is formed on the ball-stitch bump by pressing down the wire on the ball-stitch bump. The capillary is moved from the bond pad to the bond position, while loosening the wire. A stitch bond of the wire is formed on the bond position by pressing down the wire on the bond position, and then separated from the wire within the capillary. The method of wire bonding, a semiconductor chip, and a semiconductor package can reduce or minimize a moving path of the capillary and provide more effective wire bonding.

Description

CROSS REFERENCE TO RELATED APPLICATIONS [0001] This U.S. non-provisional application claims priority under 35 U.S.C. § 119 to Korean Patent Application No. 2003-61760 filed Sep. 4, 2003, the contents of which are incorporated by reference. BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates generally to electronic packaging and, more particularly, to a method of wire bonding, a semiconductor chip, and a semiconductor package. [0004] 2. Description of the Related Art [0005] In general, an electronic package is defined as the housing and interconnection of integrated circuits, also referred to as ‘semiconductor device’, ‘chip’ or ‘die’, to form an electronic system. The package should provide a structure to physically support the chip and to protect the chip from the environment, means for removing heat generated by the chips or system, and / or electrical connections to provide signal and power access to and from the chip. [0006] Wire bondi...

AI Technical Summary

Benefits of technology

[0012] Exemplary embodiments of the present invention provide a more efficient semiconductor device.

[0013] Exemplary embodiments of the present invention reduce or eliminate unnecessary motion of the capillary.

[0014] Exemplary embodiments of the present invention reduce or eliminate capillary movements to just transfer a wire from one position to another.

Problems solved by technology

This extra height may impede the ability to make thinner packages.

The bump reverse bonding, however, encounters an increase in process time due to unnecessary motion of the capillary. FIG. 7 shows the motion of the capillary in a conventional bump reverse bonding.

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