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Sliding flexible electrical contact for electrochemical processing

Inactive Publication Date: 2006-08-17
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although conductive balls as contact elements for biasing the conductive layer have demonstrated good results, service life and cost has made a search for an alternative contact element desirable.

Method used

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  • Sliding flexible electrical contact for electrochemical processing
  • Sliding flexible electrical contact for electrochemical processing
  • Sliding flexible electrical contact for electrochemical processing

Examples

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Embodiment Construction

[0018]FIG. 1 depicts a sectional view of a processing station 100 having a pad assembly 106 and one embodiment of a contact element 134 of the present invention. The processing station 100 includes a carrier head assembly 118 adapted to hold a substrate 120 against a platen assembly 142. Relative motion is provided between the pad assembly 106 and the substrate 120 during processing. The relative motion may be rotational, linear, or some combination thereof and may be provided by at least one of the carrier head assembly 118 and the platen assembly 142.

[0019] In one embodiment, the carrier head assembly 118 may be positioned over the platen assembly 142 by an arm 164 coupled to a column 130. The carrier head assembly 118 generally includes a drive system 102 coupled to a carrier head 122. The drive system 102 generally provides at least rotational motion to the carrier head 122. The carrier head 122 additionally may be actuated toward the platen assembly 142 such that the substrate...

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Abstract

Embodiments of a contact element for biasing a substrate during electrically assisted processing is provided herein. In one embodiment, the electrical contact includes a conductive base. At least one conductive flat spring is coupled to the base. A contact is coupled to each flat spring, the contact is suitable for slidably engaging a processed face of the substrate during processing.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] Embodiments of the invention generally relate to a contact assembly for electrochemical processing. [0003] 2. Description of the Related Art [0004] Electrochemical Mechanical Processing (ECMP) is a technique used to deposit or remove conductive materials from a substrate surface. For example, in an ECMP polishing process, conductive materials are removed from the surface of a substrate by electrochemical dissolution while concurrently polishing the substrate with reduced mechanical abrasion as compared to conventional Chemical Mechanical Polishing (CMP) processes. [0005] Electrochemical dissolution is performed by applying a bias between a cathode and a substrate surface to remove conductive materials from the substrate surface into a surrounding electrolyte. The bias may be applied to the substrate surface by a conductive contact disposed on or through a polishing material upon which the substrate is processed. A m...

Claims

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Application Information

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IPC IPC(8): C25D17/06C25D17/04
CPCB23H5/08B23H11/006C25D17/005
Inventor MAVLIEV, RASHID A.WADENSWEILER, RALPH M.
Owner APPLIED MATERIALS INC