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Machining apparatus using rotary grinder

a technology of rotary grinder and machining apparatus, which is applied in the direction of grinding machine components, manufacturing tools, grinding machines, etc., can solve the problem of high cost of machining apparatus

Inactive Publication Date: 2011-03-24
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, the cost for the machining apparatus has been high.

Method used

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  • Machining apparatus using rotary grinder
  • Machining apparatus using rotary grinder
  • Machining apparatus using rotary grinder

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Experimental program
Comparison scheme
Effect test

first embodiment

(First Embodiment)

A first embodiment will be described with reference to FIGS. 1 and 2. A machining apparatus according to the first embodiment is a dicing apparatus for cutting or grooving a workpiece W such as a semiconductor wafer, and includes a thin disk-like grinder 1. The grinder 1 is held between two flanges 2. A rotating shaft 4 of an actuator 3 is approximately horizontally connected to a center of each flange 2 in a radial direction.

A periphery of the grinder 1 is provided with a cutting portion 5 that performs cutting and grooving while intervening the workpiece W. The cutting portion 5 is formed to have a width dimension of 10 to 100 μm in a thickness direction of the cutting portion 5.

A chuck table 6 is provided underneath to the grinder 1 connected to the rotating shaft 4. The chuck table 6 detachably hold the workpiece W by applying a vacuum force or by using a wax.

A nozzle 7 is arranged facing the cutting portion 5 in a radial direction of the grinder 1. The nozzle ...

second embodiment

(Second Embodiment)

A second embodiment will be described with reference to FIG. 3. Note that, in the second embodiment and the other embodiments described below, the same constituent elements as the constituent elements of the aforementioned embodiments are indicated by the same reference numerals, and explanations thereof will not be repeated.

The fundamental constitution of the second embodiment is the same as the first embodiment illustrated in FIGS. 1 and 2. Meanwhile, the second embodiment includes a nozzle 7A having a different shape from the nozzle of the first embodiment.

The cross-section of the nozzle 7A when the nozzle 7A is cut in a plane parallel to the opening 7a of the nozzle 7A is formed to have an elliptic shape in which the dimension “a” in the width direction of the grinder 1 (in the X direction) is larger than the dimension “b” in the peripheral direction of the grinder 1 (in the Z direction) perpendicular to the X direction. Therefore, when the cutting fluid L is ...

third embodiment

(Third Embodiment)

A third embodiment will be described with reference to FIG. 4. The fundamental constitution of the third embodiment is the same as the first embodiment illustrated in FIGS. 1 and 2. Meanwhile, the third embodiment includes a nozzle 7B having a different inside shape from the nozzle in the first embodiment.

A peripheral shape of the nozzle 7B is formed to have a rectangular shape similarly to the nozzle 7 in the first embodiment. The nozzle 7B in the third embodiment is provided inside with a plurality of flow-straightening plates 15 along a longitudinal direction (the X direction) of a cross-section of the nozzle 7B. The flow-straightening plates 15 are arranged that the flow-straightening plates 15 straighten flow of the cutting fluid L discharged from the opening 7a of the nozzle 7B in the width direction of the grinder 1 that is the longitudinal direction of the opening 7a.

In such a configuration, the cutting fluid L discharged from the opening 7a of the nozzle ...

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Abstract

According to one embodiment, a machining apparatus includes a disk-like grinder, and a nozzle for discharging a cutting fluid toward the grinder. The grinder cuts or grooves a workpiece by rotating. The grinder is provided with a cutting portion at a periphery of the grinder. The nozzle is provided to face the cutting portion in a radial direction of the grinder and arranged adjustably in a width direction of the cutting portion. The nozzle has a rectangular or elliptic cross-section shape in which a dimension in a width direction of the grinder is larger than a dimension in a peripheral direction of the grinder.

Description

CROSS-REFERENCE TO RELATED ARTThis application is based upon and claims the benefit of priority from Japanese Patent Application No. 2009-218427, filed on Sep. 24, 2009; the entire contents of which are incorporated herein by reference.FIELDThe present embodiment relates to a machining apparatus for cutting or grooving a workpiece by pressing a rotary grinder on the workpiece such as a semiconductor wafer.BACKGROUNDA machining apparatus for cutting or grooving a workpiece by pressing a rotary grinder, which rotates with a high speed, on the workpiece such as a semiconductor wafer described in Patent Publication 1 (U.S. Pat. No. 7,101,256) has been known.The grinder in the machining apparatus described in Patent Publication 1 is a machine tool to cut the workpiece such as a semiconductor wafer, in which a width dimension of the grinder is configured to be small, having a size approximately between 10 μm to 100 μm.With respect to the grinder in process, it is required to supply a cutt...

Claims

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Application Information

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IPC IPC(8): B24B49/00B24B55/02B24B27/06H01L21/301
CPCB24B55/02B24B27/06
Inventor SUDO, MASAAKI
Owner KK TOSHIBA