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Light source package

a technology for light source and package, applied in the direction of light source semiconductor devices, lighting and heating devices, lighting support devices, etc., can solve the problems of cost-ineffective traditional lighting equipment, failure to meet the worldwide trend of energy saving and carbon reduction, etc., and achieve the effect of cost-effectiveness

Inactive Publication Date: 2012-07-05
SHEN YU NUNG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0013]The above and other objects, features and effects of the invention will become apparent with reference to the following description of the preferred embodiments taken in conjunction with the accompanying drawings, in which:
[0014]FIG. 1 is a schematic side view of a conventional incandescent light bulb;
[0015]FIG. 2 is a partial schematic perspective view of a light-emitting unit in a light source package according to the first preferred

Problems solved by technology

Such a traditional lighting equipment, however, is cost-ineffective and fails to meet the worldwide trend of energy saving and carbon reduction due to its extremely energy-consuming nature and short lifespan.

Method used

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second embodiment

[0036]FIG. 6 shows a light source package U2 according to the invention. The light source package U2 includes a mounting substrate 6, an LED die 40 and a heat pipe 7.

[0037]The mounting substrate 6 is a transparent substrate with high thermal conductivity, which has a mounting surface 60 overlaid with predetermined circuit traces (not shown).

[0038]The LED die 40 is mounted on the mounting surface 60 of the mounting substrate 6 and includes a first electrode 400 and a second electrode 401. The first electrode 400 is electrically connected to the corresponding circuit traces on the substrate 6 via a wire 61.

[0039]According to this embodiment, the heat pipe 7 has a through hole 70. The heat pipe 7 is attached onto the substrate 6, such that the LED die 40 mounted on the substrate 6 is seated within the through hole 70 of the heat pipe 7. The second electrode 401 of the LED die 40 is connected to the heat pipe 7 via a wire 62.

[0040]A transparent phosphor layer 71 is additionally formed w...

third embodiment

[0041]FIG. 7 shows a light source package U3 according to the invention. The light source package U3 includes a heat pipe 7′ and a plurality of LED dies 40. In this embodiment, the heat pipe 7′ has an end portion providing five die-mounting surfaces (three of which are shown in the drawing). Each of the die-mounting surfaces is preferably flip-chip mounted with an LED die 40.

fourth embodiment

[0042]FIG. 8 shows a light source package U4 according to the invention, which includes a light-emitting unit and a cup-like casing 8.

[0043]The cup-like casing 8 is made of ceramic material and has a closed bottom portion and an open top portion disposed oppositely to the bottom portion. It should be noted that the casing 8 may be alternatively made by sintering a ceramic material doped with iron (Fe) powder.

[0044]The cup-like casing 8 is formed on its inner surface with a heat-dissipating layer 80. According to this embodiment, the heat-dissipating layer 80 is preferably made by a material having a thermal conductivity between 400 W / (m·K) to 700 W / (m·K), such as a diamond film.

[0045]A thermal conductive layer 81 is coated on the heat-dissipating layer 80. According to this embodiment, the thermal conductive layer 81 is preferably made by a material having a thermal conductivity between 800 to 1200 W / (m·K), such as pyrolytic carbon.

[0046]The thermal conductive layer 81 is in turn ov...

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PUM

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Abstract

A light source package includes a metal base adapted for engaging a suitable electrical socket; a transparent housing assembled with the base so as to form together with the base an accommodating space; and a light-emitting unit mounted within the accommodating space. The light-emitting unit has an LED die, and the LED die is operatively disposed in the accommodating space such that the light emitted from all of the six surfaces of the LED die is completely collected for illumination.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application is a continuation application of U.S. Ser. No. 12 / 628,614 filed Dec. 1, 2009, which is a continuation-in-part of U.S. Ser. No. 11 / 932,687 filed on Oct. 31, 2007, the disclosures of all of which are incorporated herein by reference in their entirety.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a light source package.[0004]2. Description of the Prior Art[0005]Referred to as a cold light source, light emitting diode (LED) lamps differ from conventional heat-generating incandescent lamps in that they are activated to generate light by applying electric current to light-emitting material. As LEDs have been found to have advantages of being highly durable, light weighted and free of toxic materials, such as mercury, and having a long lifespan and low power consumption, solid-state lighting using LEDs has become the focus of considerable research in the lighting industry and sem...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): F21V29/00
CPCF21K9/135F21K9/56F21V3/00F21V29/006F21Y2101/02H01L33/483F21V29/773F21V23/003H01L2224/49109H01L2224/48091H01L33/648F21V29/58H01L2924/00014F21V29/51F21K9/232F21K9/238F21K9/64F21Y2115/10
Inventor SHEN, YU-NUNG
Owner SHEN YU NUNG