Tool for use with dual-sided chemical mechanical planarization pad conditioner

Abstract

A tool includes a holder configured to couple to a dual-sided chemical mechanical planarization (CMP) pad conditioner. The holder has a magnetic material, a first magnetic field strength (H1) at a first face, and a second magnetic field strength (H2) at a second face opposite the first face. The first magnetic field strength (H1) is different than the second magnetic field strength (H2).

Description

[0001]This application claims priority to and the benefit of U.S. Provisional Pat. App. No. 61 / 643,053, filed May 4, 2012, and is incorporated herein by reference in its entirety.BACKGROUND[0002]1. Field of the Disclosure[0003]The following application is directed to a tool, and more particularly to an abrasive tool for use with a dual-sided chemical mechanical planarization pad conditioner.[0004]2. Description of the Related Art[0005]In the fabrication of electronic devices, multiple layers of various types of material are deposited including for example conducting, semiconducting, and dielectric materials. Successive deposition or growth and removal of various layers results in a non-planar upper surface. A wafer surface that is not sufficiently planar will result in structures that are poorly defined, with the circuits being nonfunctional or exhibiting less than optimum performance. Chemical mechanical planarization (CMP) is a common technique used to planarize or polish workpiec...

AI Technical Summary

Benefits of technology

The patent text describes an abrasive tool for use in chemical mechanical planarization (CMP) pad conditioning, which is a process used in the fabrication of electronic devices. The tool is designed to improve the polishing performance of CMP pad conditioners by using an abrasive tool with a dual-sided chemical mechanical planarization pad conditioner. The technical effects of the patent text include improved polishing performance, reduced wear and tear of the polishing pad, and better grain pull-out. The patent also describes a method for using the abrasive tool for conducting CMP pad conditioning operations.

Problems solved by technology

A wafer surface that is not sufficiently planar will result in structures that are poorly defined, with the circuits being nonfunctional or exhibiting less than optimum performance.

Still, the conditioning operation faces certain obstacles, including the presence of polishing debris which can clog the components, chemical corrosion, conditioner geometry irregularity, conditioner over-use, and grain pull-out, which can interfere with conditioning operations and damage the sensitive electronic components being polished.

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