Chip package circuit board module

Abstract

A chip package circuit board module including a circuit board and at least one original chip is provided. The circuit board includes at least one first pad, at least one second pad and at least one substitute pad. The at least one second pad is located besides the at least one first pad and separated from the at least one first pad. The at least one substitute pad is adjacent to the at least one second pad and separated from the at least one first pad and the at least one second pad. The at least one original chip is connected to the at least one first pad and at least one the second pad, respectively. A total width of a portion corresponding to each of the at least one second pad and a portion corresponding to the substitute pad adjacent to the second pad of the first pad is greater than or equal to twice a width of the original chip.

Description

BACKGROUND OF THE INVENTION1. Field of the Invention[0001]The invention relates to a circuit board module, and more particularly, to a chip package circuit board module.2. Description of Related Art[0002]In general, a circuit board module of a light-emitting diode (LED) chip has a LED chip packaged onto a circuit board. However, when the LED chip is unable to emit light due to damages, packaging failures or other reasons, it is required to remove the LED chip, and clean up pads on the circuit board (sometimes, reprinting solder paste is also required) before a new LED chip can be packaged again.[0003]Nonetheless, a reworking process as described above may face the following problems: copper wires on a surface of the circuit board may be peeled off together when the LED chip is to be peeled off; because it may require a high temperature to applied in the process of peeling off the LED chip, the circuit board may exhibit unexpected thermal expansion or contraction in the high temperat...

AI Technical Summary

Benefits of technology

The invention provides a chip package circuit board module with a substitute chip that can be easily placed on a circuit board, a high yield rate, and a flexible design for routing on a surface while reducing glare on display presentation. The module has separate pads for the first and second chips, with the first pad being connected to both chips. The second pad has a portion corresponding to each chip, and a conductive member can connect the substitute chip to both pads. This design simplifies the replacement of the original chip with the substitute chip during reprocessing without needing to remove the original chip. Additionally, the module can have a multi-layer circuit board in which the second pad and the substitute pad are connected in advance, allowing the substitute chip to operate as a replacement of the original chip simply by connecting it to the first pad and the substitute pad.

Problems solved by technology

However, when the LED chip is unable to emit light due to damages, packaging failures or other reasons, it is required to remove the LED chip, and clean up pads on the circuit board (sometimes, reprinting solder paste is also required) before a new LED chip can be packaged again.

Nonetheless, a reworking process as described above may face the following problems: copper wires on a surface of the circuit board may be peeled off together when the LED chip is to be peeled off; because it may require a high temperature to applied in the process of peeling off the LED chip, the circuit board may exhibit unexpected thermal expansion or contraction in the high temperature environment which may damage the circuit board and lower a reliability of the circuit board; since the pads may be damaged when the LED chip is to be peeled off, packaging the new LED chip at the same position may face issues like yield reduction.

Images