The application discloses preparation and application of high-heat-resistance low-
birefringence colorless
polyimide film. Specifically, based on a
fluorine-containing side
biphenyl m-phenylenediamine, homopolymerization (or copolymerization) is carried out with commercial dianhydride,
diamine and the like, and high-performance colorless
polyimide (CPI) film is prepared through
casting, heat treatment and other processes. The
fluorine-containing side
biphenyl m-phenylenediamine is synthesized through two steps from commercial raw materials through Suzuki
coupling reaction and reduction reaction, and the
fluorine-containing side
biphenyl m-phenylenediamine can be efficiently synthesized. The CPI
film material prepared in the application exhibits excellent high-heat-resistance, low-
birefringence, high-optical-transparency, low-
dielectric performance and the like, and has potential application in the fields of flexible
liquid crystal, organic light-emitting
diode display device, wearable equipment, intelligent vehicle window and the like. In addition, the synthesis of the fluorine-containing side biphenyl
diamine is convenient, the
route is simple, the reaction is efficient, and the fluorine-containing side biphenyl
diamine is suitable for large-scale production.