Unlock instant, AI-driven research and patent intelligence for your innovation.

Multilayer circuit board forming method and multilayer circuit board

A multi-layer circuit board and circuit technology, applied in multi-layer circuit manufacturing, printed circuit, printed circuit, etc., can solve the problem of reducing the area and part

Inactive Publication Date: 2009-03-04
PANASONIC CORP
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Applied to the continuous forming method, the dimensional accuracy control is expected to be improved, but the positional accuracy control of multiple circuit boards cannot be expected to be improved.
Moreover, even if the transfer sheet method can be applied to the step-by-step forming method, it still cannot solve the problem of the reduced area portion

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multilayer circuit board forming method and multilayer circuit board
  • Multilayer circuit board forming method and multilayer circuit board
  • Multilayer circuit board forming method and multilayer circuit board

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0036] refer to figure 1 , the method of forming a multilayer circuit board according to the first embodiment of the present invention is described below. The multilayer circuit board MS1 according to the present invention is formed by using the same screen printing method as in the conventional step-by-step forming method described above.

[0037] figure 1 Shows the process of sequentially forming circuit boards one by one starting from the first layer circuit board by using the screen printing method, which includes processes P1p, P2p, P3p, P4p, P5p, P6p, P7p, and P8p shown step by step . For ease of description, the circuit boards corresponding to these processes are respectively referred to as circuit board CP (P1p), circuit board CP (P2p), circuit board CP (P3p), circuit board CP (P4p), circuit board CP hereinafter (P5p), circuit board CP (P6p), circuit board CP (P7p) and circuit board CP (P8p).

[0038] In the process P1p, the insulating board forming the first lay...

no. 2 example

[0064] refer to figure 2 with image 3 , another method for printing conductors and insulating layers on an insulating board to form a multilayer circuit board is described below. figure 2 is a cross-sectional view of the multilayer circuit board MS2 according to the second embodiment. image 3 The process of forming the multilayer circuit board MS2 is shown in figure.

[0065] as in figure 2 As shown in, the multilayer circuit board MS2 is formed by layering six insulating boards 11-1, 11-2, 11-3, 11-4, 11-5 and 11-6, each of which is Electronic circuits are installed on it. Here, the elements, heating and pressurizing methods, and conditions thereof used in this embodiment are basically the same as those described in the first embodiment, and therefore will not be described unless otherwise required.

[0066] as in image 3 As shown in , firstly prepared in the process P1p-1 is an insulating board 11-1 formed of a sheet or film comprising a plastic element such as p...

no. 3 example

[0078] refer to Figure 4 , a method for forming a multilayer circuit board combined with components such as semiconductors, resistors, capacitors, and coils is described below. Figure 4 The process of forming the multilayer circuit board MS3 according to the third embodiment is shown diagrammatically. In addition, the elements, heating and pressing methods, and conditions thereof used in this embodiment are basically the same as those described in the first or second embodiment, so unless there is a special need, they will not be described again. .

[0079] In the process P1p-b, the insulating plate 11-a formed by the method according to the first or second embodiment and embedded with the conductor 12 for forming the electronic circuit is mounted with the semiconductor device 31 having the protrusion 32 formed at the electrode portion. together. The semiconductor device 31 is placed at a predetermined position on the insulating board 11-a such that the side of the protru...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A multilayered circuit board and a method of forming the multilayer circuit board are provided. In a first circuit forming process P1p, a first circuit 12a is formed on an insulating board 11a with a conductor 12a; in a circuit embedding process P2p, the first circuit 12a is embedded in the insulating board 11a so as to have a predetermined surface flatness S and a predetermined parallelism P; in a masking process P4p, a pilot hole 15, 20 for a via hole 4, 4a is masked at a part of the surface of the circuit 12a; in an insulating layer forming process P5p, an insulating material 11b is applied as a layer to the surface except the mask 14; in an insulating material layer flattening process, the surface of the insulating material layer 11b is flattened so as to have the predetermined surface flatness S and the predetermined parallelism P; and in a pilot hole forming process, the mask 14 is removed.

Description

technical field [0001] The present invention relates to multilayer circuits formed by layering electronic circuits, each layer of electronic circuits having electronic components mounted thereon, and methods of forming said multilayer circuit boards. Background technique [0002] refer to Figure 5 , 6 and 7, a conventional method for forming a multilayer circuit board is described below. These methods can be broadly divided into two categories, which will be referred to as sequential formation methods and step-by-step formation methods later in this article. [0003] In the sequential forming method, a required number of circuit boards are prepared in advance to be layered so as to be connected to each other, thereby forming a multi-circuit board. [0004] In the step-by-step method, one layer of circuit board is formed first, and another layer of circuit board is formed on top of it. This process is repeated to form the desired number of circuit boards with integral laye...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46H05K3/00
CPCH05K2201/0376H05K3/4644H05K3/0041H05K3/002H05K2203/0582H05K2201/0179H05K3/0017H05K2203/0278Y10T29/49155Y10T29/49117Y10T29/49126Y10T29/4913Y10T29/49165H05K3/46
Inventor 西川和宏冢原法人大谷博之
Owner PANASONIC CORP