Metal spraying material of tin, zinc, cupper, and chrome without lead
A technology of spraying gold material and copper-chromium, which is applied in metal material coating process, metal processing equipment, welding/cutting medium/material, etc. Creep performance, effect of improving electrical contact performance
Inactive Publication Date: 2009-07-08
戴国水
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- Application Information
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Problems solved by technology
The existing lead-free gold spray materials are typically tin-zinc series alloys, which have the lowest melting temperature of 198°C, but tin is expensive. In order to reduce its cost, the zinc content is added, but its performance is limited to a certain extent.
Method used
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Experimental program
Comparison scheme
Effect test
Embodiment 1
[0018] Embodiment 1: 10% of zinc (Zn), 1% of copper (Cu), 0.01% of chromium (Cr), and the rest are tin (Sn) and impurities whose total amount is not more than 0.1%.
Embodiment 2
[0019] Embodiment 2: Zinc (Zn) 2%, copper (Cu) 3%, chromium (Cr) 0.05%, the rest is tin (Sn) and the impurity that total amount is not more than 0.1%.
Embodiment 3
[0020] Embodiment 3: Zinc (Zn) 20%, copper (Cu) 1.5%, chromium (Cr) 0.1%, and the rest is tin (Sn) and impurities whose total amount is not more than 0.1%.
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This invention discloses a leadless Sn / Zn / Cu alloy sputtering material for end sputtering of metalized thin film capacitor. The leadless Sn / Zn / Cu alloy sputtering material comprises: Zn 2-50 wt.%, Cu 0.55-3.5 wt.% (preferential 0.6-2.5 wt.%), Cr 0.01-0.5 wt.% (preferential 0.05-0.3 wt.%), impurities less than or equal to 0.1 wt.%, and Sn as balance. The addition of trace Cr can improve the mechanical properties, end adhesiveness, weldability, antioxidative performance, and electrical contact performance of the Sn / Zn / Cu alloy sputtering material, reduce the loss angle of the capacitor, and increase the qualification rate of the metalized thin film capacitor in 100 kHz high-frequency test.
Description
technical field [0001] The invention relates to a tin-zinc-copper-chromium lead-free gold-spraying material, which belongs to the technical field of preparation of gold-spraying materials on the end faces of metallized film capacitors. Background technique [0002] The existing gold-sprayed materials on the end face of metallized film capacitors are typically lead-based five-component gold-sprayed materials and tin-zinc-based gold-sprayed materials. However, due to the great toxicity of lead to humans, it has attracted great attention from the world and the rise of lead-free trend. Many alternative lead-free gold-spraying materials have come out, and lead-free materials with better performance are still being developed to replace lead-containing gold-spraying materials. At present, the general requirements for lead-free gold-spraying materials are: 1. Lead The content is less than 0.1%; 2. The gold-sprayed layer and the lead wire have good weldability; 3. The gold-sprayed l...
Claims
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IPC IPC(8): C23C24/00C22C13/00C22C18/00C22C30/00B23K35/22
Inventor 戴国水
Owner 戴国水
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