Unlock instant, AI-driven research and patent intelligence for your innovation.

Circuit connection method

A circuit connection and electrical connection technology, applied in the structural connection of printed circuits, circuits, printed circuit components, etc., can solve the problems of inability to obtain connection reliability, insufficient substrate adhesion, and insufficient

Inactive Publication Date: 2009-08-05
RESONAC CORPORATION
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, conventional anisotropic conductive adhesives have insufficient adhesion to various substrates, and cannot achieve sufficient connection reliability.
In particular, lowering of the connection temperature and shortening of the connection time, etc., which are required to reduce damage to the substrate during connection or positional shift and improve production efficiency, cannot be sufficiently and reliably satisfied.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit connection method
  • Circuit connection method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] In terms of solid content weight ratio, 20 grams of butyral resin (in solid content) converted through carboxylic acid, 30 grams of phenoxy resin (in solid content), 49 grams of urethane acrylate, and phosphoric acid ester type acrylic acid 1 gram of ester (manufactured by Gongrongsha Oil Co., Ltd., trade name P2M), 5 grams of tertiary hexyl peroxy-2-ethylhexanoate (10 grams as DOP solution) are mixed, and then dispersed 3% by volume The conductive particles were coated and dried to obtain a circuit connection material with an adhesive layer thickness of 8 microns.

[0063] (Production of circuit connection structure)

[0064] Under the conditions of 80° C., 5 seconds, and 1 MPa, the above-mentioned circuit connection material in a strip with a width of 1.5 mm was temporarily connected to the glass substrate on which the ITO electrodes were formed. Peel off the PET substrate, align it with the electrode where the TCP is installed, and make a formal connection under the...

Embodiment 2

[0066] In terms of solid content weight ratio, 30 grams of butyral resin (calculated as solid content) converted from carboxylic acid, 30 grams of phenoxy resin (calculated as solid content), 39 grams of urethane acrylate, and phosphate ester acrylate (manufactured by Kyorongsha Oil Co., Ltd., trade name P2M) 1 gram, 5 grams of tertiary hexyl peroxy-2-ethylhexanoate (10 grams as DOP solution) were mixed, and then dispersed and mixed 3% by volume The conductive particles were coated and dried to obtain a circuit connection material with an adhesive layer thickness of 8 microns.

[0067] (Production of circuit connection structure)

[0068] Under the conditions of 80° C., 5 seconds, and 1 MPa, temporarily connect the above-mentioned circuit connection material in strips with a width of 1.5 mm to the glass substrate on which the ITO electrodes are formed. Peel off the PET base material, align it with the electrode where the TCP is installed, and make a formal connection at 150°C...

Embodiment 3

[0070] In terms of solid content weight ratio, 10 grams of butyral resin (calculated as solid content) converted from carboxylic acid, 35 grams of phenoxy resin (calculated as solid content), 54 grams of urethane acrylate, and phosphate ester acrylate (manufactured by Gongrongshe Oil Co., Ltd., trade name P2M) 1 gram, 5 grams of tertiary hexyl peroxy-2-ethylhexanoate (10 grams in terms of DOP solution) are mixed, and then dispersed and mixed conductive particles 3 % by volume, coated and dried to obtain a circuit connection material with an adhesive layer having a thickness of 8 micrometers.

[0071] (Production of circuit connection structure)

[0072] Make the above-mentioned circuit connection material into strips with a width of 1.5 mm, and make temporary connections on the glass substrate forming the ITO electrodes under the conditions of 80° C., 5 seconds, and 1 MPa. Peel off the PET base material, align it with the electrode where the TCP is installed, and make a forma...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
glass transition temperatureaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

A circuit connection method is to use an adhesive for circuit connection, interpose the adhesive for circuit connection between substrates having opposing circuit electrodes, pressurize the substrates having opposing circuit electrodes, and thereby electrically connect and pressurize A circuit connection method between electrodes in a direction, characterized in that the adhesive contains a compound having an acid equivalent of 5 to 500 in terms of KOH mg / g.

Description

[0001] This application is a divisional application, the application number of its parent application: 01808255.6, the filing date: 2001.4.25, the name of the invention: adhesive for circuit connection, circuit connection method using it, and circuit connection structure technical field [0002] The present invention relates to an adhesive for circuit connection, a circuit connection method using the same, and a circuit connection structure. Background technique [0003] In the past, the connection between liquid crystal display and tape carrier package (TCP) or flexible printed circuit (FPC), and the connection between TCP or FPC and printed circuit board used anisotropic adhesives in which conductive particles were dispersed. Conductive adhesive. Moreover, recently, when the semiconductor silicon chip is mounted on the substrate, the wire bonding method is no longer used. Instead, the semiconductor silicon chip is directly mounted on the substrate face down, and the so-cal...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60H05K1/14H05K3/32H05K3/36C09J9/02C09J11/00C09J201/00
Inventor 野村理行藤绳贡小野裕金泽朋子汤佐正己
Owner RESONAC CORPORATION