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Handler for sorting packaged chips

A technology for installing chips and processors, which is applied in the field of processors for packaging chips

Inactive Publication Date: 2009-09-16
MIRAE CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, not all packaged chips are always removed from the tray for transfer to the unloading unit

Method used

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  • Handler for sorting packaged chips
  • Handler for sorting packaged chips
  • Handler for sorting packaged chips

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0027] Reference will now be made in detail to the preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings.

[0028] figure 1 is a view schematically showing a handler for sorting packaged chips after a burn-in test according to an embodiment of the present invention. refer to figure 1 , a handler for sorting packaged chips after burn-in testing is now described.

[0029] The handler for sorting the packaged chips after the burn-in test includes: a main body 1; a burn-in board B that contains the packaged chips after the burn-in test and is movable to the main body 1; a loading unit 3 in which, Trays containing packaged chips to be subjected to the burn-in test are waiting; an unloading unit 4 in which trays combined to accommodate good packaged chips that have passed the burn-in test are waiting.

[0030] The burn-in board transfer unit 20 moves the burn-in board B to the center of the main body 1, that is, the working space. ...

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PUM

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Abstract

The invention provides a handler for sorting and packaging chips, comprising: a main body; a loading unit, which is arranged on one side of the main body, and in the loading unit, trays accommodating packaged chips to be subjected to a burn-in test are carried out wait; burn-in board, which contains packaged chips after burn-in test, and the burn-in board can be moved in the working space of the main body; unloading unit, in which, is combined to accommodate the burn-in board A tray of tested packaged chips is waiting; and a tray transfer unit that removes the packaged chips remaining in the tray from the tray by rotating the tray during transfer of the tray from the loading unit to the unloading unit. The invention provides the advantage of inverting the tray during its transfer from the loading unit to the unloading unit in order to remove packaged chips remaining in the tray for the tray.

Description

technical field [0001] The present invention relates to a handler for sorting packaged chips after a burn-in test, and more particularly to a handler for sorting packaged chips after a burn-in test, the handler being equipped with The tray transfer unit is used to transfer the tray bounded to include the packaged chips after the burn-in test from the loading unit to the unloading unit. Background technique [0002] After the chip manufacturing process, the packaged chip is subjected to a series of tests to verify that its performance is up to specification. Electrical testing checks the general performance of packaged chips and ensures that they meet specific input and output voltage, capacitance, and current specifications. Functional testing actually performs specific chip functions. The purpose of the burn-in test is to strengthen the electrical connection between the chip and the package, and the burn-in test will bring any contaminants in the chip body into the active...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/67H01L21/677
CPCG01R31/2893G01R31/2867H01L21/683H01L22/00
Inventor 金钟太
Owner MIRAE CORPORATION