Flexible copper-polyimide laminate and manufacturing method thereof

The technology of polyimide layer and polyamic acid is applied in the field of flexible copper-polyimide laminate and its manufacturing, and can solve the problems of high unit cost, expensive polyimide film, complicated manufacturing process and the like, Achieving the effect of low moisture content and good dimensional stability
CN101010191AInactive Publication Date: 2007-08-01KOLON IND INC
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
KOLON IND INC
Publication Date
2007-08-01
Estimated Expiration
Not applicable · inactive patent

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Abstract

The present invention provides a flexible copper-polyimide laminate including a linear random block polyimide layer formed on the at least one side thereof, the linear random block polyimide layer comprising 0.25 to 90.25 mol.% of a repeating unit l represented by the formula 1, 0.25 to 90.25 mol.% of a repeating unit m represented by the formula 2, 0.25 to 90.25 mol.% of a repeating unit n represented by the formula 3, and 0.25 to 90.25 mol.% of a repeating unit o represented by the formula 4. The flexible copper-polyimide laminate having a polyimide layer is free from curls and excellent in dimensional stability, tensile property, folding endurance and resistance to flexural fatigue with low moisture content.
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Description

technical field

[0001] The invention relates to a flexible copper-polyimide laminated board and a manufacturing method thereof. More specifically, the present invention relates to a flexible copper-polyimide laminate having a polyimide layer and a method for manufacturing the same. The layer was prepared by polymerizing polyamic acid from two diamines and two dianhydrides, coating the polyamic acid on a copper film and imidizing it. Background technique

[0002] Recently, the rapid growth of industry and technology has significantly accelerated the development of the electronics industry related to mobile phones, PDPs, etc. in an obvious way, and miniaturization and flexible technology have become indispensable and necessary for the electronics material industry .

[0003] Many methods have been proposed to overcome the problem of using adhesives in this industrial field, only solving the problem of decrease in non-combustibility, but causing curling and wrinkling due to t...

Claims

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