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Device for an optoelectronic component and module with an optoelectronic component and a device

A technology for optoelectronic components and optical components, which is applied to electrical components, electrical solid-state devices, circuits, etc., and can solve problems such as deformation or instability of radiation effect, increase in deterioration of optical connections, etc.

Inactive Publication Date: 2007-09-26
OSRAM OPTO SEMICON GMBH & CO OHG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such adhesive connections are generally not stable with respect to deformations of the casting or the effects of radiation, thus increasing the risk of deterioration of the optical connection of the optical component to the semiconductor chip

Method used

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  • Device for an optoelectronic component and module with an optoelectronic component and a device
  • Device for an optoelectronic component and module with an optoelectronic component and a device
  • Device for an optoelectronic component and module with an optoelectronic component and a device

Examples

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Embodiment Construction

[0057] FIG. 1 schematically shows a first exemplary embodiment of a device 1 according to the invention, FIG. 1A being an oblique perspective view from above, and FIG. 1B being an oblique perspective view from below.

[0058] The device 1 comprises a plurality of fasteners 2 , in the exemplary embodiment four fasteners 2 , which are provided for fastening the device to the housing of the optoelectronic component. Furthermore, the device is designed as a holder for individual optical elements. To this end, in the window 4 of the device 1 , which is formed, for example, by the recess of the frame 3 , holding means 5 are provided for a separate optical element, which is preferably produced separately from the device. The window 4 can, for example, have a shape corresponding to the frame, in particular rectangular or square. Preferably, the fasteners are led out from corner areas of the frame 3 .

[0059] The device 1 preferably has a substantially four-sided square or rectangul...

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PUM

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Abstract

A device (1) is disclosed, comprising at least one fixing element (2), whereby the fixing element is provided for fixing the device to a housing body (8) of an optoelectronic component (7) and the device (1) is embodied as a mounting for a separate optical element (10).

Description

technical field [0001] The invention relates to a device for optoelectronic elements and a module comprising the device and optoelectronic elements. Background technique [0002] For beam shaping in conventional optoelectronic components, a lens is often arranged behind the semiconductor chip of the component. Thus, for example, the lens is glued to a casting that protects the semiconductor chip. However, such adhesive connections are generally unstable with respect to deformations or radiation effects of the casting, thus increasing the risk of deterioration of the optical connection of the optical component to the semiconductor chip. In addition, lenses used in conventional optoelectronic components often experience reduced performance under short-wavelength, especially ultraviolet or blue radiation, which can be manifested, for example, by clouding, discoloration or deformation of the lenses. Contents of the invention [0003] The object of the present invention is to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L31/0203H01L33/48H01L33/58
CPCH01L31/0203H01L2224/73265H01L2224/48247H01L2924/3025H01L33/486H01L31/0232H01L33/58H01L31/02325H01L2224/48091H01L2924/00014H01L2924/00
Inventor G·博格纳M·希格勒M·罗斯G·韦特尔M·沃尔夫
Owner OSRAM OPTO SEMICON GMBH & CO OHG