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OPENGL to OPENGLó±ES translator and OPENGLó±ES emulator

一种翻译过程、翻译算法的技术，应用在三维应用开发领域，能够解决资源浪费性能、丢失、没有考虑多个纹理等问题

Active Publication Date: 2007-10-24
STMICROELECTRONICS SHANGHAI R&D
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This means using useless commands and data in the solution, which leads to a waste of resources and a dramatic loss of performance
Second, in the Dylogic solution, the array state is not recorded and restored in the glEnd command
This can cause memory problems
Third, the Dylogic solution does not take into account multiple textures
[0010] In summary, the Dylogic translator solution is an incomplete solution, at best suboptimal capable of running basically all (if not all) OpenGL applications on top of a compliant OpenGL|ES implementation

Method used

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  • OPENGL to OPENGLó±ES translator and OPENGLó±ES emulator
  • OPENGL to OPENGLó±ES translator and OPENGLó±ES emulator

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Experimental program
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Embodiment Construction

[0035] To address the deficiencies of the prior art, embodiments of the present invention wrap OpenGL applications at runtime with a small configurable layer between the application and the OpenGL|ES rendering engine. This layer performs optimized game-agnostic translations with most common OpenGL APIs and extensions. Using this solution, the visual performance in OpenGL|ES should provide similar results or at least a very good approximation to the native OpenGL graphics system.

[0036] In the drawings and in connection with the description of the embodiments of the invention the following symbols are used:

[0037] ArrV is a two-dimensional data array used to store the position data of vertex elements, with a size of m×4;

[0038] ArrC is a two-dimensional data array used to store the color data of vertex elements, with a size of m×4;

[0039] ArrN is a two-dimensional data array used to store the normal data of vertex elements, with a size of m×3;

[0040] ArrT0 is used ...

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Abstract

The invention relates to an OpenGL to openGL / ES translator and openGL / ES simulator. Prior art is lack of the 3D application based on OpenGL / ES standard, to require the 3D application on OpenGL / ES mobile device as honeycomb telephone, based on OpenGL / ES standard, which requires calling translation function between OpenGL and OpenGL / ES standard. For supporting the translation and confirming right data of execution of OpenGL application, the invention stores the globe GL state changed by the OpenGL / ES function used in translated period, and uses OpenGL / ES command to replace OpenGL command to translate OpenGL to OpenGL / ES, to transmit OpenGL / ES API, returns pre-stored globe GL state, to avoid the executed translation to affect the following execution of OpenGL application. For a plurality of known expansions of OpenGL API, the translation can translate OpenGL to OpenGL / ES.

Description

technical field [0001] The present invention relates to three-dimensional (3D) application development for mobile devices, such as G4M type devices, using the OpenGL|ES graphics standard, and in particular to translations to allow running of OpenGL applications on top of OpenGL|ES implementations device. Background technique [0002] The 3D graphics standard OpenGL is commonly used for graphics rendering in a personal computer (PC) environment. The graphics standard OpenGL|ES is a lighter version of the OpenGL standard that targets mobile devices, such as mobile phones and other handsets. Although the OpenGL|ES standard is established, there is a problem that the OpenGL|ES standard is so new that there are very few 3D applications based on the standard in the market. However, there do exist a considerable number of legacy applications written in OpenGL for personal computers. Until more suitable OpenGL|ES standard-based applications appear on the market, consumers want th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F9/45G06T15/00
CPCG06T15/00
Inventor C·夸尔李海珍陈国基
Owner STMICROELECTRONICS SHANGHAI R&D
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