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High frequency connector assembly

一种连接器组件、连接器的技术，应用在连接、连接装置的零部件、接触部件等方向，能够解决连接器不是传输高频信号等问题

Inactive Publication Date: 2008-06-25
TENSOLITE CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, this connector is not particularly suitable for transmitting high-frequency signals, such as data and / or communication signals of a connector assembly between two circuit boards

Method used

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  • High frequency connector assembly
  • High frequency connector assembly
  • High frequency connector assembly

Examples

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Embodiment Construction

[0052] Referring to FIGS. 1 and 2, the connector assembly 10 includes two substantially parallel signal-carrying assemblies, such as circuit boards 12, 14 (circuit board 14 is shown in phantom), a signal array 16 (including at least one shielded conductor 18). ) and compressible interface components 20, 22 connecting circuit boards 12, 14 and shielded conductor 18 (compressible interface components 22 are shown in dashed lines). The circuit boards 12 , 14 include respective shielded solder pads 24 , 26 , only solder pad 26 being shown in FIG. 1 . The shielded conductor 18 has opposite ends and includes a shaft conductive member 38 and an outer conductive member 40 surrounding the shaft conductive member 38 . The shielded pads 24 , 26 include a central conductive core region 28 and a conductive outer structure region 30 . The pads 24, 26 on the circuit boards 12, 14 may be etched, deposited, or fabricated using other methods known to those skilled in the art.

[0053] Althoug...

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PUM

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Abstract

A connector or connector assembly 200 having a signal array 202 having at least one shielded conductor 204 having opposite ends and including an axial conductive element 230 and an outer conductive element 232 surrounding the axial conductive element and a compressible interface element 220 positioned at least one of the opposite ends of the signal array 202, the interface element 220 including alayer of insulating material having a plurality of conductive elements extending through the insulating material layer. When compressed between the signal array and a signal-bearing component, the compressible interface element 220 maintains the geometric arrangement of the axial conductive element 230 and the outer conductive element 232 to the signal-bearing component.

Description

[0001] related application [0002] This application is a continuation-in-part of US Patent Application Serial No. 10 / 702,192, filed November 5, 2003, entitled "Zero Insertion Force High Frequency Connector," which is hereby incorporated by reference. technical field [0003] The present invention relates generally to electrical connectors, and in particular to improving the performance, structure and ease of use of high frequency electrical connectors. Background technique [0004] The tremendous increase in the use of various electronic products in today's society has created a tremendous increase in the demand for improved components used in these products. One aspect of using such electronic products is the coupling of high frequency signals, ie, the coupling of data and / or communication signals between various signal-carrying components such as circuit boards. [0005] Some electronic products include a frame into which multiple circuit blocks are inserted. Typically,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R13/24H01R24/02H01R13/646
CPCH01R24/50H01R2103/00H01R13/2414H01R23/26H01R12/52H01R12/714H01R12/78H01R13/646
Inventor C·A·塔特K·J·彼得斯T·P·迪克斯
Owner TENSOLITE CO