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Exhaust unit, exhausting method, and semiconductor manufacturing facility with the exhaust unit

A technology for manufacturing equipment, exhaust methods, applied in the direction of semiconductor/solid-state device manufacturing, lighting and heating equipment, control input involving air characteristics, etc., which can solve problems such as time-consuming and labor-intensive

Inactive Publication Date: 2008-08-13
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It takes a lot of time and labor

Method used

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  • Exhaust unit, exhausting method, and semiconductor manufacturing facility with the exhaust unit
  • Exhaust unit, exhausting method, and semiconductor manufacturing facility with the exhaust unit
  • Exhaust unit, exhausting method, and semiconductor manufacturing facility with the exhaust unit

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Embodiment Construction

[0041] Preferred embodiments of the present invention will be described in more detail hereinafter with reference to FIGS. 2 to 17 . However, the present invention can be implemented in different forms, and will not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Accordingly, elements in the drawings are exaggerated for clarity of illustration.

[0042] Hereinafter, an exemplary embodiment of the structure of the exhaust unit 20 provided on the semiconductor manufacturing equipment 1 according to the present invention will be described. However, the technical scope of the present invention is not limited thereto, and the exhaust unit 20 may be used in various other applications where the exhaust volume fluctuates due to external influences.

[0043] FIG. 2 is a plan view of a semiconductor manufacturing fa...

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Abstract

Provided is an exhaust unit capable of preventing large pressure fluctuations within a process chamber due to atmospheric pressure changes. The exhaust unit includes a main exhaust duct and a supplemental exhaust duct that acts as a partial bypass. A flap is located at a downstream opening between the main exhaust duct and supplemental exhaust duct and controls the amount of bypassed gas flowing from the supplemental exhaust duct to the main exhaust duct. First and second plates of the flap are pivotally coupled to the main exhaust duct adjacent the downstream opening, the first plate colliding with gas flowing through the main exhaust duct and the second plate partially blocking bypassed gas flowing back into the main exhaust duct from the supplemental exhaust duct. When gas is exhausted through the main exhaust line and the supplemental exhaust duct, the flap passively controls the amount by which the supplemental exhaust duct is opened through fluctuations in atmospheric pressure.

Description

[0001] Cross References to Related Applications [0002] This U.S. nonprovisional patent application claims priority under 35 U.S.C. §119 to Korean Patent Application No. 10-2007-00740, filed January 3, 2007, the entire contents of which are hereby incorporated by reference. technical field [0003] The present invention disclosed herein relates to a semiconductor manufacturing apparatus, and in particular, to an exhaust unit and an exhaust method for exhausting gas from a process chamber to reduce the pressure within the process chamber. Background technique [0004] Generally, semiconductor manufacturing equipment has a plurality of process chambers in a clean room and an exhaust unit that controls the pressure in the process chambers. Each process chamber is connected to a branch pipe for exhausting gas from the process chamber, and the corresponding branch pipe is connected to the main pipe. The main pipe consists of a primary pipe fitted with a fan and a secondary pipe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00H01L21/02H01L21/67C23C16/44
CPCF24F11/022F24F2011/0042F24F2110/40F24F11/72F24F2140/10H01L21/02
Inventor 安康镐金玧定姜锡勋李载荣崔载兴黄正性
Owner SAMSUNG ELECTRONICS CO LTD