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Apparatus for manufacture of cover tape

A bladed, flat technology applied in the field of devices for the manufacture of cover tapes, capable of solving problems of reduced aesthetic value, roll instability, contamination, etc.

Inactive Publication Date: 2008-10-01
3M INNOVATIVE PROPERTIES CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This is problematic because it can lead to adhesive sticking in undesired locations, creating contamination, extra cleaning, reduced aesthetic value, and other issues such as unwanted equipment downtime
Additionally, when cover tape made of flat film (i.e., film without grooves) is wound on itself, it can cause unwanted sagging between the adhesive strips, resulting in roll instability

Method used

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  • Apparatus for manufacture of cover tape
  • Apparatus for manufacture of cover tape
  • Apparatus for manufacture of cover tape

Examples

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Embodiment Construction

[0023] Aspects of the invention relate to cover tapes, carrier tape / cover tape systems, and methods and apparatus for making cover tapes. The cover tape according to the invention can be adhered to a carrier tape which can hold components for storage and transport. The cover tape can cover pockets in the carrier tape that hold components, and can be partially detached from the system to expose the pockets in the carrier tape. Favorable tear features on the cover tape allow one portion of the cover tape to be separated from other portions of the cover tape (and the carrier tape to which the cover tape is attached) with a substantially consistent and uniform separation force that reduces the The possibility of unwanted movement of components held by the medium carrier tape. As used herein, the term "tear" generally refers to the controlled separation of parts of an element. Additionally, the cover tape according to the present invention provides grooves along the longitudinal ...

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PUM

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Abstract

An apparatus (200) for creating cuts or scores in a substrate includes a support structure (206), one or more blades (220) and a secondary support (202B). The support structure has one or more cavities (208), which collectively define a substantially planar reference surface (224). Each blade has a cutting edge, which contacts the substantially planar reference surface, and each blade is biased against the substantially planar reference surface. An opening (212) is defined through the substantially planar reference surface of the support structure to expose a portion of the cutting edge (222) of each blade. The secondary support is capable of holding a portion of the substrate between the secondary support and in contact with the exposed portions of the cutting edges of the blades .

Description

Background technique [0001] The invention relates to an apparatus for manufacturing cover tapes for carrying components with tapes. [0002] In a manufacturing environment, there is often a need to hold and transport components. For example, in the art of electronic circuit assembly, it is often necessary to transport electronic components from a component supply to a specific location on a circuit board to be attached. Components may be of many different types, including surface mount components. Specific examples include memory chips, integrated circuit chips, resistors, connectors, processors, capacitors, gate arrays, and the like. Small precision components can be transported using a carrier tape / cover tape system as disclosed in US Patent No. 5,325,654. [0003] As the electronics industry continues to move toward smaller devices, these smaller components in turn require the ability to remove these components from carrier tape / cover tape systems with greater precision ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B26D3/08
CPCB26D7/2614B26D3/085B26D3/08B26D3/00
Inventor 鲁本·E·韦拉斯克斯乌理
Owner 3M INNOVATIVE PROPERTIES CO
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