Cover tape and method for manufacture

Abstract

An article includes a cover tape, which includes a base film layer, recessed areas, tear enabling features, and an adhesive. The base film layer has opposed longitudinal edges. The recessed areas extend along the longitudinal edges of the base film layer. The tear enabling features are substantially parallel to the longitudinal edges. The adhesive is disposed on the recessed areas.

Description

Background technique [0001] The present invention relates to cover tapes for conveying components and methods and apparatus for making such cover tapes. [0002] In a manufacturing environment, there is often a need to grip and transport components. For example, in the art of electronic circuit assembly, it is often necessary to transport electronic components from a component supply to a specific location on a circuit board to be attached. Components can be of many different types, including surface mount components. Specific examples include memory chips, integrated circuit chips, resistors, connectors, processors, capacitors, gate arrays, and the like. Small precision components may be transported using a carrier tape / cover tape system as disclosed in US Patent No. 5,325,654. [0003] As the electronics industry continues to move toward smaller devices, these smaller components require carrier / cover tape systems that can remove these components with greater precision and...

AI Technical Summary

Problems solved by technology

This is problematic because it can cause the adhesive to stick in undesired locations, creating contamination, unnecessary cleaning, reduced aesthetic value, and other problems (such as unwanted equipment downtime)

Furthermore, if the cover tape made of flat film (i.e. film without grooves) is wound on itself, it can cause undesired sagging between the adhesive strips, resulting in roll instability

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