Unlock instant, AI-driven research and patent intelligence for your innovation.

Semiconductor-integrated electronic device having a plurality of leads

A technology for integrating electronics and semiconductors, applied in semiconductor devices, semiconductor/solid-state device components, circuits, etc., can solve problems such as inability to ensure semiconductor integrated electronic devices

Inactive Publication Date: 2008-11-05
STMICROELECTRONICS SRL
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In fact, it is completely ineffective for electrical interconnection structures made of iron-nickel alloys, however, it is not guaranteed to obtain completely whisker-free semiconductor integrated electronic devices
[0020] Furthermore, when the distance between adjacent leads is reduced, the likelihood of short circuits occurring between the leads themselves increases, e.g. due to deformation

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor-integrated electronic device having a plurality of leads
  • Semiconductor-integrated electronic device having a plurality of leads
  • Semiconductor-integrated electronic device having a plurality of leads

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] With reference to these figures, there is presented a semiconductor integrated electronic device 1 comprising a body 2 of plastic material, typically epoxy resin, which contains a chip and an interconnection structure. Leads or pins 3 electrically connected to the interconnect structure protrude from at least one edge of the body 2 of plastics material instead.

[0039] In particular, these leads 3 are metal strips of width R1 protruding from the edge of the plastic material body 2 and are, for example, shaped like seagulls.

[0040] In particular, the leads 3 are bent so that their ends are on the same plane.

[0041] Typically, the body of plastics material 2 is substantially rectangular, and the leads 3 protrude from one or more edges or one or more sides of the body of plastics material 2 .

[0042] Usually, the leads 3 protruding from the same edge of the body 2 of plastics material are spaced apart from each other and adjacent to each other.

[0043] In particul...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A semiconductor-integrated electronic device (1) is described comprising: - a body (2) of plastic material, - a plurality of leads (3), adjacent and in spaced relation to each other, projecting from at least one edge of said body (2) of plastic material, and - a spacer device (4) which comprises a plurality of insulating teeth (5) interposed between said plurality of leads (3), so as to form an insulating barrier between adjacent leads of said plurality of leads (3) projecting from a body (2) of plastic material.

Description

technical field [0001] The present invention relates to a semiconductor integrated electronic device provided with a plurality of leads. [0002] The invention relates especially, but not exclusively, to semiconductor integrated electronic devices provided with a plurality of leads and including isolation means to avoid possible short circuits between adjacent leads, and the following description relates to this field of application for the purpose of simplification only. Background technique [0003] As is well known, semiconductor integrated electronic devices comprise integrated circuits implemented on a die of semiconductor material rigidly mounted on an electronic interconnection structure and encapsulated by a body of plastic material having a protective function. [0004] An electronic interconnection structure typically includes: a support plate, usually a thin metal foil (lead frame), with the chip disposed at its central portion; and a plurality of rigid metal cond...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/00
CPCH01L2924/0002H01L23/49555H01L23/49558H01L2924/00
Inventor F·马奇西G·A·巴布拉诺
Owner STMICROELECTRONICS SRL