Supercharge Your Innovation With Domain-Expert AI Agents!

Printed circuit board

A technology of printed circuit substrate and base insulating layer, applied in the directions of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve problems such as the reduction of electrical signal transmission efficiency

Inactive Publication Date: 2012-07-04
NITTO DENKO CORP
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, the transmission efficiency of the electrical signal of the printed circuit board 700 decreases.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Printed circuit board
  • Printed circuit board
  • Printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0028] (1) Manufacturing method of printed circuit board

[0029] figure 1 It is a process cross-sectional view showing the manufacturing method of the printed circuit board which concerns on 1st Embodiment of this invention.

[0030] First, if figure 1 As shown in (a), an insulating base layer 1 is prepared. The insulating base layer 1 is made of, for example, polyimide. The thickness of the insulating base layer 1 is preferably not less than 5 μm and not more than 50 μm, more preferably not less than 10 μm and not more than 30 μm.

[0031] Next, if figure 1 As shown in (b), a plurality of conductor patterns (wiring patterns) 2 having a predetermined pattern are formed on the insulating base layer 1 by a well-known semi-additive method. Conductor pattern 2 is made of copper, for example. The thickness of the conductive pattern 2 is preferably not less than 5 μm and not more than 30 μm, more preferably not less than 8 μm and not more than 24 μm. In addition, the widt...

no. 2 approach

[0046] Figure 4 It is a cross-sectional view showing a printed circuit board according to a second embodiment of the present invention. The printed circuit board 200 of the second embodiment and figure 1 The printed circuit board 100 of (c) differs in the following points.

[0047] Such as Figure 4 As shown, in the printed circuit board 200 of this embodiment, the ground layer 5 is provided on the lower surface of the insulating base layer 1 . In addition, a cover insulating layer 7 is provided on the lower surface of the base insulating layer 1 so as to cover the ground layer 5 via the adhesive layer 6 .

[0048] Wherein, the ground layer 5, the adhesive layer 6 and the cover insulating layer 7 can be respectively used with figure 1 The conductive pattern 2, the adhesive layer 3 and the cover insulating layer 4 are formed by the same method and material. In addition, in this embodiment, the plurality of conductor patterns 2 are located inside the ground layer 5 in th...

Embodiment

[0061] Printed circuit boards of Examples and Comparative Examples were produced, and the characteristic impedance of the conductor pattern was measured.

[0062] (Example)

[0063] In the example, making Figure 4 The printed circuit substrate 200 is illustrated. Wherein, the thickness of the insulating base layer 1 is 25 μm, the width of the conductive pattern 2 is 40 μm, the thickness of the conductive pattern 2 is 10 μm, and the thickness of the insulating cover layer 4 is 12.5 μm.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A printed circuit board includes a base insulating layer and a conductor pattern provided on the base insulating layer. The conductor pattern includes a line portion linearly extending along a virtual axis line in a line region, a first bend portion extending along the axis line while being bent in a convex shape toward one side of the base insulating layer in a first bend region, and a second bend portion extending along the axis line while being bent in a convex shape toward the other side of the base insulating layer in a second bend region. The conductor pattern is formed such that the first bend portion and the second bend portion do not overlap with each other in a vertical direction when the printed circuit board is folded along a boundary.

Description

technical field [0001] The present invention relates to printed circuit substrates. Background technique [0002] A plurality of flexible printed circuit boards are used in electronic equipment, electric equipment, and the like (see, for example, JP-A-2002-111138). Hereinafter, the flexible printed circuit board is simply referred to as a printed circuit board. [0003] Figure 5 It is a perspective view showing the appearance of a conventional printed circuit board. Figure 5 The printed circuit board 700 shown has an insulating base layer 701 and a long conductor pattern 702 provided on the insulating base layer 701 . In addition, a cover insulating layer (not shown) is formed on the insulating base layer 701 so as to cover the conductive pattern 702 . [0004] The printed circuit board 700 having such a structure is excellent in bendability, as Figure 5 As shown, it can be easily bent at any position. Thus, according to the prior art, the printed circuit board 700 can...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02
CPCH05K1/0393H05K3/281H05K2201/09263H05K1/0218H05K2201/055H05K1/0228
Inventor 本上满田中壮宗
Owner NITTO DENKO CORP
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com