Composite slice type inductive element and preparation method thereof

Abstract

The invention relates to a composite material chip type inductive element and the preparation method thereof. The inductive element is applicable to the extreme-high / ultra-high frequency range chip type inductive element, adopts the three-phase composite material containing hexagonal surface soft magnetic ferrite powder, metal magnetic particles and high-temperature resistant resin as the magnetic medium, and can adjust the electromagnetic property of the material based on the three-phase composite double-seepage theory; the composite material chip type inductive element comprises a flush-type helical inner electrode and a terminal electrode which is directly connected with the inner electrode, and can adopt the base metals, such as Ni and Cu to be taken as the inner electrode material, thereby greatly reducing the cost of the element; the composite material chip type inductive element is prepared by utilizing the polymer hot pressing process, thereby avoiding the difficulty of heterogeneous co-firing in the lamination co-firing technology of the traditional chip type inductive element. The element has the advantages that the weight is light, the volume is small, the magnetic screening effect is good, the requirement of the automatic solder-reflow process can be satisfied, the production process is simple, the production cycle is short, the technical parameter is easy-to-control, the production energy consumption is low, and the element is applicable to the large-scale industrialized production.

Description

technical field

[0001] The invention belongs to the field of electronic components, in particular to a chip-type inductive element prepared by a hot-pressing process using a three-phase composite material as a magnetic medium and a preparation method thereof, which can be used for chip-type inductive elements in even / ultra-high frequency bands. Background technique

[0002] As one of the three major passive components, inductive components are widely used in various electronic products. With the development of electronic computers and communication technologies, the operating frequency of electronic circuits is getting higher and higher, which has exceeded GHz, which requires the application frequency of corresponding electronic components to be higher than GHz. At present, NiZnCu ferrite is used as the magnetic medium for chip inductive components, but NiZnCu ferrite is limited by its cubic crystal structure, and the cut-off frequency is very low, so it cannot be used in ev...

Examples

Embodiment 1

[0026] Embodiment 1: Chip Co 2 Preparation of Y-Ni-PPS Inductor

[0027] The volume ratio is 60%, the particle diameter is about 8 microns Co 2 Y(Ba 2 co 2 Fe 12 o 22 ), Ni powder with a volume ratio of 8%, a particle diameter of 0.5 microns, and a volume ratio of 32% of polyphenylene sulfide. Weigh 6.54 grams of Co according to the above proportions 2 Y, 1.42 grams of nickel powder and 0.86 grams of PPS, and then fully mixed evenly.

[0028] Take a thin copper wire to make a spiral inner electrode, connect with the terminal electrode, put it into the mold and fix the position. Take an appropriate amount of evenly mixed composite material powder and fill it into the mould, completely submerging the inner electrode coil.

[0029] Put the hot pressing mold with composite material powder and inner electrode on the automatic press, raise the temperature to 290°C, apply a pressure of 4MPa, and keep it for 15min, then cool down, and then release the mold after cooling down t...

Embodiment 2

[0030] Example 2: Preparation of Chip BaM-Ni-PPS Inductor

[0031] Ti-substituted BaM (BaFe 10.9 Ti 1.1 o 22 ), Ni powder with a volume ratio of 8%, a particle diameter of 0.5 microns, and a volume ratio of 32% of polyphenylene sulfide. Weigh 6.36 grams of BaM, 1.42 grams of nickel powder and 0.86 grams of PPS according to the above proportions, and then fully mix them evenly.

[0032] Take a thin copper wire to make a spiral inner electrode, connect with the terminal electrode, put it into the mold and fix the position. Take an appropriate amount of evenly mixed composite material powder and fill it into the mould, completely submerging the inner electrode coil.

[0033]Put the hot pressing mold with composite material powder and inner electrode on the automatic press, raise the temperature to 290°C, apply a pressure of 4 MPa, and keep it for 15 minutes, then cool down, and then release the mold after cooling down to room temperature to obtain BaM-Ni-PPS Composite chip i...

Embodiment 3

[0034] Embodiment 3: Chip Co 2 Preparation of Z-Fe-PPS magnetic beads

[0035] The volume ratio is 58%, the particle diameter is about 8 micron Co 2 Z(Ba 3 co 2 Fe 24 o 41 ), Fe powder with a volume ratio of 12%, a particle diameter of 0.5 microns, and a volume ratio of 30% polyphenylene sulfide. Weigh 6.22 grams of Co according to the above ratio 2 Z, 1.77 grams of iron powder and 0.8 grams of PPS, fully mixed evenly.

[0036] Take a thin copper wire to make a spiral inner electrode, electrically connect with the terminal electrode, put it into the mold and fix the position. Take an appropriate amount of evenly mixed composite material powder and fill it into the mould, completely submerging the inner electrode coil.

[0037] Put the hot-press mold with composite material powder and internal electrode on the automatic press, raise the temperature to 290°C, apply a pressure of 4MPa, and keep it for 15min, then cool down, and release the mold after cooling down to room ...

technical field

[0001] The invention belongs to the field of electronic components, in particular to a chip-type inductive element prepared by a hot-pressing process using a three-phase composite material as a magnetic medium and a preparation method thereof, which can be used for chip-type inductive elements in even / ultra-high frequency bands. Background technique

[0002] As one of the three major passive components, inductive components are widely used in various electronic products. With the development of electronic computers and communication technologies, the operating frequency of electronic circuits is getting higher and higher, which has exceeded GHz, which requires the application frequency of corresponding electronic components to be higher than GHz. At present, NiZnCu ferrite is used as the magnetic medium for chip inductive components, but NiZnCu ferrite is limited by its cubic crystal structure, and the cut-off frequency is very low, so it cannot be used in ev...

Examples

Embodiment 1

[0026] Embodiment 1: Chip Co 2 Preparation of Y-Ni-PPS Inductor

[0027] The volume ratio is 60%, the particle diameter is about 8 microns Co 2 Y(Ba 2 co 2 Fe 12 o 22 ), Ni powder with a volume ratio of 8%, a particle diameter of 0.5 microns, and a volume ratio of 32% of polyphenylene sulfide. Weigh 6.54 grams of Co according to the above proportions 2 Y, 1.42 grams of nickel powder and 0.86 grams of PPS, and then fully mixed evenly.

[0028] Take a thin copper wire to make a spiral inner electrode, connect with the terminal electrode, put it into the mold and fix the position. Take an appropriate amount of evenly mixed composite material powder and fill it into the mould, completely submerging the inner electrode coil.

[0029] Put the hot pressing mold with composite material powder and inner electrode on the automatic press, raise the temperature to 290°C, apply a pressure of 4MPa, and keep it for 15min, then cool down, and then release the mold after cooling down t...

Embodiment 2

[0030] Example 2: Preparation of Chip BaM-Ni-PPS Inductor

[0031] Ti-substituted BaM (BaFe 10.9 Ti 1.1 o 22 ), Ni powder with a volume ratio of 8%, a particle diameter of 0.5 microns, and a volume ratio of 32% of polyphenylene sulfide. Weigh 6.36 grams of BaM, 1.42 grams of nickel powder and 0.86 grams of PPS according to the above proportions, and then fully mix them evenly.

[0032] Take a thin copper wire to make a spiral inner electrode, connect with the terminal electrode, put it into the mold and fix the position. Take an appropriate amount of evenly mixed composite material powder and fill it into the mould, completely submerging the inner electrode coil.

[0033]Put the hot pressing mold with composite material powder and inner electrode on the automatic press, raise the temperature to 290°C, apply a pressure of 4 MPa, and keep it for 15 minutes, then cool down, and then release the mold after cooling down to room temperature to obtain BaM-Ni-PPS Composite chip i...

Embodiment 3

[0034] Embodiment 3: Chip Co 2 Preparation of Z-Fe-PPS magnetic beads

[0035] The volume ratio is 58%, the particle diameter is about 8 micron Co 2 Z(Ba 3 co 2 Fe 24 o 41 ), Fe powder with a volume ratio of 12%, a particle diameter of 0.5 microns, and a volume ratio of 30% polyphenylene sulfide. Weigh 6.22 grams of Co according to the above ratio 2 Z, 1.77 grams of iron powder and 0.8 grams of PPS, fully mixed evenly.

[0036] Take a thin copper wire to make a spiral inner electrode, electrically connect with the terminal electrode, put it into the mold and fix the position. Take an appropriate amount of evenly mixed composite material powder and fill it into the mould, completely submerging the inner electrode coil.

[0037] Put the hot-press mold with composite material powder and internal electrode on the automatic press, raise the temperature to 290°C, apply a pressure of 4MPa, and keep it for 15min, then cool down, and release the mold after cooling down to room ...

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