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Method and system for stamping wafer laser

A technology of laser marking and wafer, applied in the field of laser marking method and its system, which can solve the problems of increased working time of operators, fragile wafers, increased probability of laser marking errors, etc.

Inactive Publication Date: 2010-11-17
KING YUAN ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the laser engraving provided on the wafer can only engrave the same content to be engraved at one time. If more than two types of content are to be engraved on the same wafer, the wafer must be ejected and then loaded into the The marking stage is used to mark another content. For details, please refer to figure 1 As shown, such an operation method obviously causes the wafer to enter and exit the marking station many times, which will increase the operating time of the operator, the risk of wafer breakage, and increase the error rate of laser marking

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  • Method and system for stamping wafer laser
  • Method and system for stamping wafer laser
  • Method and system for stamping wafer laser

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Embodiment Construction

[0023] Since the present invention discloses a laser marking method and system for wafer testing in the semiconductor back-end process, the basic principles of the semiconductor process used therein have been understood by those skilled in the art, so the following description will not be repeated. full description. At the same time, the accompanying drawings below show the structural representations related to the features of the present invention, and do not and need not be completely drawn according to the actual size, so please describe first.

[0024] First please also refer to figure 2 and Figure 4 According to the first preferred embodiment provided by the present invention, it is a laser marking method for a wafer. The laser marking method of the wafer (step 20) marks various information on the wafer in a laser mode, including the following steps:

[0025] (1) Provide engraved documents ( figure 2 Step 21), wherein the content of the imprint file refers to the m...

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Abstract

The invention provides a wafer laser marking method and a system thereof. The method uses the laser marking mode to mark various kinds of information on the wafer, and mainly comprises the following steps of: providing a marking document which contains a plurality of different kinds of marking information corresponding to different chips; reading the marking file; providing a data working-storagesection to store part or all of the marking file according to the sequence of the chips; loading the wafer into marking equipment; executing positioning of the wafer; marking the marking information corresponding to each chip of the wafer on the passive surface of the chip in sequence, until marking is completed; and releasing the wafer from the marking equipment.

Description

technical field [0001] The invention relates to a wafer laser marking method and its system, in particular to a laser marking method and its system capable of simultaneously marking multiple information on a wafer. Background technique [0002] In the semiconductor wafer manufacturing process, after the probe test (chip probe) on the wafer (wafer) is completed, according to the test results (bin code) of each chip (die) on the wafer, laser marking (laser marking) is used to The test results are printed on the passive surface corresponding to the position of the chip on the wafer, as disclosed in Taiwan Patents TW594897, TW589693, TW516149, US Patents US7020582 and US6996484 in the prior art. However, the laser engraving provided on the wafer can only engrave the same content to be engraved at one time. If more than two types of content are to be engraved on the same wafer, the wafer must be ejected and then loaded into the The marking stage is used to mark another content. ...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00
Inventor 郑匡文卢玟瑀
Owner KING YUAN ELECTRONICS