Method for coating different tin paste on single plate and module group thereof
A stencil set and solder paste technology, which can be applied to devices and coatings that apply liquid to surfaces, and can solve problems such as uneconomical, labor-intensive, time-consuming, and damage.
Inactive Publication Date: 2011-07-27
UNIVERSAL GLOBAL SCI IND +1
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Problems solved by technology
[0007] Since the solder paste 14 currently used in the industry varies depending on the purpose of use and the solder, the general circuit board 12 must be coated with more than two types of solder paste 14 (such as tin-zinc solder) depending on the use requirements. , tin-lead solder), and the aforementioned printing method or printing method using the mask 11, although the solder paste 14 formed with multiple regions can be coated on the circuit board 12, the aforementioned process can only be used on a single board. Surface 121 is coated with a single type of solder paste 14 using the same solder. If the aforementioned process is repeated to apply the second type of solder paste, the mask 11 will damage the first type of solder paste 14 and cannot be implemented. Therefore, At present, the second type of solder paste is still applied manually, which not only consumes manpower and time, but is also quite uneconomical.
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[0021] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.
[0022] refer to figure 2 , shows a preferred embodiment of the template set of the present invention, which is a tool for coating different solder pastes on a single board, including: a first template 2 and a second template 3 .
[0023] The first template 2 has a first type of solder paste 41 (such as Figure 5 Shown) a first die hole 21 filled.
[0024] The second template 3 has a cavity 32 formed on a bottom surface 31 corresponding to the first mold hole 21, for the second type of solder paste 42 (such as Figure 8 ) into a second die hole 33 , and a sealing portion 35 formed on a top surface 34 and corresponding to the cavity 32 . The cavity 32 is located at a position staggered from the second die hole 33, and is formed by stamping in this preferred embodiment, and the sealing portion 35 is integrally formed to prevent the second type of sol...
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The present invention relates to a template set which is applied to a single board surface and coated with different solder pastes. The template set mainly comprises a first template and a second template. The first template is provided with at least a first die hole. The second template is provided with at least a recess which is formed at one side and is corresponding to the first die hole as well as at least a second die hole. The method comprises the following steps: a first kind of solder paste is filled by passing through the first die hole of the first template to ensure that the boardsurface is coated with a first solder paste region; then the first solder paste region is hidden in the recess of the second template; a second kind of solder paste is filled by passing through the second die hole of the second template to ensure that the board surface is coated with a second solder paste region. Therefore, the single board surface is provided with the first solder paste region and the second solder paste region which use different solders.
Description
technical field [0001] The invention relates to a method for coating solder paste, in particular to a method for coating different solder pastes on a single board surface and a template group thereof. Background technique [0002] refer to figure 1 , taking the case of Taiwan Announcement No. 518919 as an example, a printing method of solder paste includes the following steps: [0003] In the first process, a mask 11 is placed on a circuit board 12 . The mask 11 has a plurality of holes 111 corresponding to the circuit board 12 . [0004] In the second process, a scraper 13 is used to scrape and fill a solder paste 14 containing tin-zinc solder into the hole 111 of the mask 11 . [0005] In the third process, the mask 11 and the circuit board 12 are separated, and the solder paste 14 is coated on the circuit board 12 . [0006] However, although the aforementioned printing method can be used to coat the solder paste 14 on the circuit board 12, it has the following proble...
Claims
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IPC IPC(8): B05D1/32B05D1/36B05D7/24
Inventor 郑吉雄詹婉祯李训发
Owner UNIVERSAL GLOBAL SCI IND