UV B-stageable, moisture curable composition useful for rapid electronic device assembly

A composition, moisture curing technology, applied in the direction of non-polymer organic compound adhesives, adhesive types, ester copolymer adhesives, etc., can solve the problems of reducing the production volume of other materials, material inefficiency, expensive and other issues

Inactive Publication Date: 2009-04-08
3M INNOVATIVE PROPERTIES CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the material is known to be inefficient and expensive due to "slump" issues causing adhesive to flow out of the intended application site, excessive waste during die-cutting of the film, and an in-line curing step that reduces throughput of other materials

Method used

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  • UV B-stageable, moisture curable composition useful for rapid electronic device assembly
  • UV B-stageable, moisture curable composition useful for rapid electronic device assembly
  • UV B-stageable, moisture curable composition useful for rapid electronic device assembly

Examples

Experimental program
Comparison scheme
Effect test

example

[0052] material list

[0053] product name /

Material

source

illustrate

AGEFLEX PEA

Ciba Specialty Chemicals (Tarrytown, NJ)

Phenoxyethyl Acrylate

SAX 350

Zhongyuan Chemical Industry Co., Ltd. Dexa

Houston Branch (Houston, Texas)

Alkoxysilane-terminated polyether

HELOXY 107

Hexion Specialty Chemicals

(Houston, Texas)

epoxy resin

DAROCUR 1173

Ciba Specialty Chemicals (Tarrytown, NJ)

2-Hydroxy-2-methyl-phenylacetone

RHODORSIL 2074

Rhodia Silicones

(Climberley, NJ)

Diaryliodonium tetrakis(pentafluorophenyl)borate

ITX

First Chemical Corporation (Park, Mississippi

Skagula)

Isopropylthioxanthone

Silver / Glass 43 Micron

Porter Industries, Inc. (Pennsylvania

Valley Forge, Asia)

Silvered glass sphere

SnAcAc

Gellert Co. (Pennsylvania

Morrisville, Asia)

Tin acetylacetonate ...

example 1

[0059] Phenoxyethyl acrylate (PEA) (49.3 pph of the total mixture), SAX350 (32.8pph), DAROCUR 1173 (0.7pph) and Catalyst Solution 1 (2.63pph) were mixed in a Speedmixer DAC 400 FVZ at Mix for one minute at 2200 revolutions (RPM). Thixotropic agent AEROSIL R202 (4.0 pph) was added to the mixture, and the new mixture was mixed with a DAC mixer at a speed of 2200 RPM for three minutes. Conductive particle silver / glass-43 micron (12.2 pph) was added to the above mixture, and the new mixture was mixed with a DAC mixer at 2200 RPM for one minute. The mixture was stored in plastic cups protected from light.

[0060] Using the same procedure used to prepare Example 1, Comparative Examples A, B and C and Examples 2 to 4 were prepared using the materials listed in Tables 1 and 2.

[0061] Table 1

[0062] Example 1

Comparative Example A

Comparative Example B

Comparative Example C

PEA

48.2

--

49.1

49.6

InChemRez TM

...

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PUM

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Abstract

The invention provides an adhesive composition which is useful for electronic assembly comprising a photopolymerizable acrylic resin containing polymerizable acrylate, a moisture-curable resin including an alkoxy or acyloxy silane terminated polymer, a photoinitiator for initiating polymerization of the acrylate, and a photoacid generator for catalyzing a moisture curing reaction of the alkoxy or acyloxy silane terminated polymer. Also provided are assemblies including such adhesives, such as electronic assemblies and radio frequency identification tags.

Description

technical field [0001] The present invention generally relates to a B-staged moisture-curable composition, in particular, relates to a B-staged moisture-cured composition after ultraviolet radiation. The composition is useful for attaching radio frequency identification tags to substrates. Background technique [0002] There is an increasing need in the electronics industry to reduce production costs in electronic device assembly operations. The need to reduce costs is especially true in certain mass assembly applications, such as radio frequency identification ("RFID") tags, in order to facilitate their widespread adoption. One way to reduce costs in some applications is to use adhesives to join the various components together. However, the material is known to be inefficient and expensive due to "slump" issues causing adhesive to flow out of the intended application site, excessive waste during film die cutting, and an in-line curing step that reduces throughput of other...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J133/08C09J133/06C09J4/02
CPCC09J4/06C09J133/08C08L83/00C08L101/10C09J183/04
Inventor 迈克尔·A·克罗普罗伯特·L·D·曾纳
Owner 3M INNOVATIVE PROPERTIES CO
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