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Electronic assembly remanufacturing system and method

An electronic component, remanufacturing technology, applied in the direction of printed circuit manufacturing, electrical components, electrical components, etc., can solve the problem of not showing the cost-effectiveness of repeated desoldering solder mask

Inactive Publication Date: 2013-07-17
CATERPILLAR INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in addition to the need to provide a pool of molten solder as large as the entire PCB, the '820 method requires the design, manufacture, application and removal of solder mask, with all the attendant expense and complexity
Additionally, regardless of whether the '820 soldermask will work properly in a given application, it does not appear to be a robust, cost-effective solution for providing repeated desoldering soldermasks.

Method used

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  • Electronic assembly remanufacturing system and method
  • Electronic assembly remanufacturing system and method
  • Electronic assembly remanufacturing system and method

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Embodiment Construction

[0017] The present invention generally relates to systems for remanufacturing circuit board assemblies and other electrical assemblies that require the selective removal of one or more components from the assembly to allow access to a portion of the assembly for repair, for example or analysis. Often, the remanufacturing process of circuit assemblies requires the removal and inspection of components and / or portions of assemblies in order to determine remedial action to be taken. Then, by adjusting or replacing one or more parts or components, the tested assembly is made to work properly, and then the parts are reassembled and tested.

[0018] Typically, an electronic assembly, such as an ECU, intended for use in an industrial or other demanding environment includes a working part, such as a printed circuit board, and a housing that protects the working part from the surrounding environment. Accordingly, the housing is typically removed to allow access to the working parts of ...

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Abstract

A method for remanufacturing an electronic assembly includes removing a first portion of an assembly housing to expose an underside of an enclosed circuit assembly. One or more solder joints on the underside of the circuit assembly are associated with at least one component that is also affixed to a portion of the housing. The opened electronic assembly is lowered onto a desoldering fixture having a plurality of solder pots configured to encompass, and thus desolder, the solder joints associated with the component that is affixed to a portion of the housing. Once the affected solder joints are melted, the remaining portion of the housing and the component affixed thereto may be lifted away, exposing the top surface of the circuit assembly for analysis, repair, and or adjustment.

Description

technical field [0001] The present invention relates generally to the remanufacturing of electronic circuits, and more particularly to systems and methods for the remanufacturing of electronic assemblies having one or more components secured to separate housings. Background technique [0002] With the advent of integrated electronics, mechanical and electromechanical features have been largely eliminated from electrical circuits in many applications, reducing the maintenance and adjustment chores associated with these applications. However, these electrical circuits, as well as the mechanical features of the circuit housings, connection points, etc., still require repair, adjustment or even replacement from time to time. For example, the power circuit may overheat and deteriorate. Vibration and other mechanical forces can affect the circuit and / or its housing or its connections to other circuit components. However, due to the relative permanence of integrated circuit compo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/00H05K3/34
CPCH05K3/225H05K5/0047H05K2203/176H05K13/04H05K5/0034H05K3/3447H05K2203/0763H05K3/3468
Inventor P·C·戈特沙尔E·N·S·格雷罗
Owner CATERPILLAR INC