Fluorescent lamp with build-in lighting circuit and manufacturing method thereof
A technology for lighting circuits and fluorescent lamps, which is applied to circuits, circuit layouts, components of lighting devices, etc., and can solve problems such as the weakening of glass lampshades
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no. 1 example
[0040] figure 1 is a partially cutaway side view showing an example structure of a fluorescent lamp 10 with a built-in lighting circuit (hereinafter simply referred to as "fluorescent lamp 10") used in the first embodiment of the present invention. figure 2 is a plan view showing an example structure of the fluorescent lamp 10 used in the first embodiment.
[0041] as in figure 1 As shown in , the fluorescent lamp 10 includes a fluorescent tube 1, a lampshade 2 covering the fluorescent tube 1, a lighting circuit 3 for lighting the fluorescent tube 1, a lighting circuit housing unit 4 for accommodating the lighting circuit 3, a heat shrinkable tape 5 and a cap (Cap) 6 . The heat shrink tape 5 is endless (endless) and is made to be attached across the outer surfaces of the lamp cover 2 and the lighting circuit accommodating unit 4 .
[0042] A power supply terminal of the lighting circuit 3 is joined to the cover 6 . An output terminal of the lighting circuit 3 is connected...
no. 2 example
[0060] Figure 4 is a partially cutaway side view showing an example structure of a fluorescent lamp 10 with a built-in lighting circuit (hereinafter simply referred to as "fluorescent lamp 10") used in a second embodiment of the present invention. Figure 5A and 5B yes Figure 4 A magnified view of part J and a view showing the effect of the heat shrink tape. Figure 5A shows the state before attaching and heating the heat shrink tape 5, and Figure 5B The state after attaching and heating the heat shrink tape 5 is shown.
[0061] In the second embodiment, when the shade 2 and the lighting circuit accommodating unit 4 are joined, the vicinity of the joined face is cylindrical, and the cross-sectional diameter becomes largest at the joined face. Other structural aspects are the same as with respect to the first embodiment.
[0062] The adhesive is applied to the attachment surface 4a of the lighting circuit accommodating unit 4, the globe 2 is closed, and the bonding surf...
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