Light-emitting device mounting substrate and method for producing same, light-emitting device module and method for manufacturing same, display, illuminating device, and traffic signal system

Abstract

Disclosed is a light-emitting device mounting substrate wherein an enamel layer (23) having a thickness within the range of 50-200 [mu]m is formed on the surface of a core metal (22) which is provided with a reflective cup portion (28) for reflecting the light emitted from a mounted light-emitting device (24) toward a predetermined direction. Also disclosed is a light-emitting device module (20) obtained by mounting a light-emitting device on the light-emitting device mounting substrate and sealing the light-emitting device with a transparent sealing resin (26). The light-emitting device mounting substrate is excellent in light extraction efficiency, and can be produced at a low cost. Further disclosed are a method for producing such a light-emitting device mounting substrate, a light-emitting device module using such a light-emitting device mounting substrate, a method for manufacturing such a light-emitting device module, and a display, illuminating device and traffic signal system each comprising such a light-emitting device module.

Description

technical field [0001] The present invention relates to a light-emitting element mounting substrate for mounting light-emitting elements such as light-emitting diodes (hereinafter referred to as LEDs) and a manufacturing method thereof, a light-emitting element module obtained by mounting and packaging a light-emitting element on the substrate, and a manufacturing method thereof . A display device, a lighting device, and a traffic signal using the light-emitting element module. Background technique [0002] Conventionally, in light-emitting element modules mounted with light-emitting elements such as LEDs and packaged, in order to reduce the size of the package structure, use such as Figure 10 shown in the surface mount package configuration. In this light-emitting element module, a recess is provided on a substrate 3 made of resin or ceramics, and positive and negative electrodes 4, 4 are arranged on the bottom surface of the recess, and the light-emitting element 1 is ele...

AI Technical Summary

Problems solved by technology

Especially when heat dissipation is emphasized, from the viewpoint of thermal conductivity, it is of course suitable to use metal as the material constituting the substrate. However, when using metal as the substrate, it also has the property of conductivity, so it is necessary to use metal between the electrodes and the substrate. Insulation treatment is carried out between them, and the insulation board also becomes a part of the laminated structure, which further complicates the structure

[0019] The assembly of the base material for forming the reflector part is usually carried out by adhesive or hot stamping, but due to the low smoothness of the substrate or uneven application of the adhesive required for assembly, the reflector part There will be a gap between the base material for part formation and the substrate, and then air bubbles will be generated when the sealing resin is injected into the cover part

When air bubbles remain in the sealing resin, the light emitted from the light-emitting element is largely scattered by the air bubbles, so there is a problem that the extraction efficiency of light emitted by the light-emitting element is greatly reduced.

[0020] In addition, since it is necessary to use a base material for forming the reflector part that is separate from the substrate, additional steps are required in assembly, so there is a problem that the cost increases

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