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Processer

A technology for processing devices and workpieces, applied to fine working devices, stone processing equipment, manufacturing tools, etc., can solve problems such as pressing device space and complicating the mechanism inside the device, and achieve the effect of simplifying the mechanism

Active Publication Date: 2012-06-27
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] However, if a conveying member such as an arm is provided in each treatment area as in the devices described in Patent Documents 3 and 4, there is a problem that the space in the device is compressed and the mechanism in the device becomes complicated.

Method used

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Embodiment Construction

[0027] Hereinafter, the best mode for carrying out the present invention will be described with reference to the drawings. First, a processing apparatus according to a first embodiment of the present invention will be described. figure 1 It is a perspective view showing the processing apparatus of this embodiment, figure 2 is set in the figure 1 A top view of the layout of the processing areas within the processing apparatus shown. figure 1 The processing device 1 of the present embodiment shown is a device for processing a workpiece supported by an adhesive tape at the opening of a ring-shaped frame. figure 2 As shown, the processing device 1 is provided with at least a cartridge loading area 2, a frame temporary storage area 3, and a processing area 4, and a protective film forming area and / or a cleaning area may be provided as required.

[0028] The cassette loading area 2 in the processing device 1 of this embodiment is provided with a cassette table having an elevati...

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Abstract

The invention provides a processor, which can ensure the space and simplify the mechanisms of devices. The processor (1) comprises: a maintaining component for maintaining workpieces (7) supported at the opening of annular frameworks (8) by a bonding belt, a processing component for processing the workpieces (7) maintained at the maintaining component, and a vacating component (11) which vacates the annular frameworks (8) from a case (6) loaded on a case work platform to a temporary placing area (3) of frameworks, wherein a locating device (10) is arranged in the processor (1) and comprises: framework guideways (12a, 12b) which load the annular frameworks vacated by the vacating component (11), and a guideway driving component (14) which causes the framework guideways (12a, 12b) to be at the position where the annular frameworks (8) are opened and at the clamping position where the annular frameworks (8) are located and moves the annular frameworks from the temporary placing area (3) to a next working procedure area (5).

Description

technical field [0001] The present invention relates to a processing device for processing various workpieces such as semiconductor wafers, glass, metal, and plastic. Background technique [0002] For example, in the manufacturing process of a semiconductor device, a plurality of circuits such as IC (integrated circuit: integrated circuit) or LSI (large-scale integration: large-scale integration) are formed on the surface of a roughly disc-shaped semiconductor wafer. Each region of these circuits is diced in a grid pattern along predetermined streets (cutting lines), thereby manufacturing individual semiconductor chips. [0003] As a device for dicing a semiconductor wafer, a cutting device is generally used. Such a device for cutting semiconductor wafers is usually provided with: a chuck table, which utilizes negative pressure to absorb and hold workpieces such as semiconductor wafers; cutting tool (for example, refer to Patent Document 1). [0004] In addition, when cut...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/677H01L21/68H01L21/78B28D5/00
Inventor 饭塚健太吕大宫直树
Owner DISCO CORP