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Backboard component and communication equipment using same

A technology of backplane components and communication equipment, which is applied in the field of communication, and can solve problems such as the inability to perform online replacement and the division of live slots, the small spacing between circuit board plug-ins, and the impact on system operation.

Inactive Publication Date: 2009-11-04
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] If you want to replace the small-size circuit board plug-in with a large-size circuit board plug-in, you need to pull out the slide rail support plate. However, since the slide rail support plate is inserted into the communication equipment frame, it occupies a certain slot space, and the circuit board The distance between the plug-ins is small, not only the plug-ins in the slot, but also the plug-ins near the slot need to be disassembled to pull out the slideway support plate, and online replacement and live slot separation cannot be achieved, thus affecting the overall system run

Method used

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  • Backboard component and communication equipment using same
  • Backboard component and communication equipment using same
  • Backboard component and communication equipment using same

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Embodiment Construction

[0034] An embodiment of the present invention provides a communication device. Figure 4a is a perspective view of a communication device according to an embodiment of the present invention, Figure 4b for Figure 4a A schematic diagram of the partial structure of the backplane assembly and the circuit board plug-in installed on it in the communication equipment shown, Figure 4c for Figure 4b cross-sectional view. refer to Figures 4a-4c , the communication device 1 of this embodiment is provided with a backplane assembly 10. According to actual business requirements, a plurality of service circuit board inserts 20 of different sizes are plugged into the backplane assembly 10, so that the circuit board insert 20 is installed On communication device 1.

[0035] refer to Figures 4a-4c and Figure 5 , the communication device 1 of the embodiment of the present invention includes a backplane assembly 10 and a circuit board insert 20 plugged into the backplane assembly 10...

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Abstract

The invention discloses a backboard component which comprises a backboard, slide ways and a middle slide way, wherein the slide ways are positioned on both opposite sides of the backboard; the backboard is provided with a plurality of slots for connecting circuit board plug-in units; the slide ways on both sides are provided with slide way slots; and the middle slide way is provided with notches which correspond to the slide way slots and extend from a free end to the backboard. Under the condition of not changing the structure of the backboard component, the slots on the backboard can be inserted with the circuit board plug-in units in different sizes according to needs so as to realize the function of cutting energized slots. The invention also discloses communication equipment using the backboard component.

Description

technical field [0001] The invention relates to the technical field of communications, in particular to a backplane assembly and communication equipment using the backplane assembly. Background technique [0002] Generally speaking, communication equipment, especially system-level communication equipment (relative to terminal equipment), is generally designed in a modular manner. Specifically, the communication device includes a backplane and many circuit board inserts with different functions. The backplane has a plurality of slots, and these circuit board inserts can be conveniently inserted into each slot of the backplane. [0003] With the development of communication technology, service traffic needs to increase sharply, and the density of service circuit boards on communication equipment is increasing. Since the physical size of the communication equipment remains unchanged and the density of the circuit board is high, the physical size and spacing of the circuit boar...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/14H05K7/18
Inventor 彭永辉
Owner HUAWEI TECH CO LTD
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