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Hot melt adhesive

A technology of hot-melt adhesives and adhesives, applied in the direction of wax adhesives, adhesives, etc., can solve the problems of not being suitable for low temperature applications

Inactive Publication Date: 2010-03-31
汉高股份两合公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Unfortunately, since triglycerides have a much higher molecular weight than paraffin - about 890 Da for pure tristearate of glycerol versus 430 Da for regular paraffin, adhesives using highly hydrogenated triglycerides have Higher viscosity, which makes them unsuitable for low temperature applications

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Soy wax was tested for compatibility with ethylene vinyl acetate copolymer based adhesive formulations having the formulations shown in Table 1 (Samples 1-5).

Table 1

Embodiment 2

[0034] Soy wax was tested for compatibility with ethylene n-butyl acrylate (EnBA) copolymer based adhesive formulations having the formulations shown in Table 2 (Samples 6-10).

Table 2

Embodiment 3

[0035] Adhesive formulations containing various melting point hydrogenated soy waxes in EnBA copolymers having the formulations shown in Table 3 (Samples 11-16) were tested.

table 3

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PUM

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Abstract

Low application temperature hot melt packaging adhesives comprising vegetable derived wax such as a soy wax are described.

Description

field of invention [0001] The present invention relates to low application temperature application hot melt adhesives comprising waxes and paraffins of vegetable origin. Background of the invention [0002] Hot melt adhesives are applied to a substrate while molten and then placed in contact with a second substrate. The adhesive cools and hardens to form a bond between the substrates. Hot melt adhesives are widely used in industrial adhesive applications such as product assembly and packaging. The latter includes the sealing of boxes and boxes. [0003] Hot melt adhesives used in packaging applications such as case and box sealing typically consist of polymers, thinners or tackifiers and waxes. One function of the wax component is to reduce viscosity due to its low molecular weight. Currently used packaging adhesives contain waxes of petroleum origin, such as paraffin and microcrystalline waxes. The lower molecular weight of paraffin waxes makes them the first choice wh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J123/08C09J191/06
CPCC09J123/0853C08L45/00C09J123/0869C09J191/06C08L91/06C08L2666/02C08L2666/04C08L2666/06C09J123/08
Inventor L-Z·龚D·L·哈纳
Owner 汉高股份两合公司