Single-piece type pressurized deairing device
A pressurized defoaming, single-chip technology, applied in lamination, lamination auxiliary operation, optics, etc., can solve the problems of manufacturers' time and cost control, and achieve the effect of controlling time and cost
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[0015] For being able to describe in detail the monolithic pressure degassing device of the present invention, please refer to image 3 . The structure of the present invention for improving the adhesiveness of the panel frame glue includes a first plate 22 with a first groove 24 on its upper surface. A first ring 44 is provided on the periphery of the upper surface of the first plate 22. The material of the first groove 24 is heat-resistant pressure-resistant material, and the material of the first plate 22 can be heat-resistant and pressure-resistant material or plastic material. In this embodiment, the heat-resistant and pressure-resistant material is steel.
[0016] The second board 26 is located above the first board 22 , and there is a distance A between the first board 22 and the second board 26 . The lower surface of the second plate 26 has a second groove 28, the periphery of the lower surface of the second plate 26 is provided with a second ring 46, the material of...
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