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Front-opened wafer box for fixing wafer restriction part module in mode of rotating, resisting and fixing

A restrictor and front-opening technology, which is applied in the field of fixing the wafer restrictor module of the front-opening wafer box, can solve problems such as looseness, difficult cleaning of particulate dust, and inability to reduce the size of the wafer box. The effect of shortening the size

Active Publication Date: 2010-06-16
GUDENG PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] According to the wafer box of the known technology, its wafer restraint or wafer restraint module is likely to cause problems such as the inability to reduce the size of the wafer cassette, difficulty in cleaning and loosening of particulate dust, and the like. The purpose of the present invention is to provide a wafer restrainer with Modular Front Opening Wafer Cassette

Method used

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  • Front-opened wafer box for fixing wafer restriction part module in mode of rotating, resisting and fixing
  • Front-opened wafer box for fixing wafer restriction part module in mode of rotating, resisting and fixing
  • Front-opened wafer box for fixing wafer restriction part module in mode of rotating, resisting and fixing

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Embodiment Construction

[0027] In order to have a more complete and clear understanding of the technical content used in the present invention, the purpose of the invention and the effects achieved, a detailed description will be given in conjunction with the accompanying drawings.

[0028] First, see Figure 4 Shown is a schematic diagram of a front-opening wafer cassette of the present invention. The front opening wafer box includes a box body 10 and a door body 20. A plurality of slots 11 are provided inside the box body 10 to accommodate a plurality of wafers, and an opening 12 is provided on one side of the box body 10. Wafer input and output are available. The door body 20 has an outer surface 21 and an inner surface 22, and a recessed area 24 is arranged at about the middle of the inner surface 22 of the door body 20. This recessed area 24 can further divide the inner surface 22 of the door body 20 into two convex portions. out of the platform 25, and a wafer restraint module 30 is provided ...

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PUM

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Abstract

The invention discloses a front-opened wafer box, which mainly comprises a box body, and a door body, wherein a plurality of slots for accommodating a plurality of wafers are formed in the box body, and an opening is formed on one side of the box body for inputting and outputting a plurality of wafers. The door body comprises an external surface and an internal surface, is combined with the opening of the box body by the internal surface and is used for protecting the plurality of wafers in the box body. The front-opened wafer box is characterized in that: at least one restriction part module is assembled on the internal surface of the door body and has a base which is provided with a plurality of restriction parts arranged at intervals and a hole, and the internal surface of the door body is provide with a resisting and fixing part, so that the resisting and fixing part is resisted and fixed on the restriction part module after penetrating the hole of the restriction part module and the base thereof and rotating the restriction part module an angle.

Description

technical field [0001] The present invention relates to a front-opening wafer box, in particular to the fixing method of the wafer limiting module of the front-opening wafer box. The fixing method is to rotate the wafer limiting module at an angle to make it fixed on the inner surface of the door. Background technique [0002] Semiconductor wafers will be transported to different workstations due to the need to go through various processes and to cooperate with process equipment. In order to facilitate the handling of the wafers and avoid external contamination, a sealed container is often used for automatic equipment delivery. see figure 1 Shown is a schematic diagram of a known wafer box. The wafer pod is a Front Opening Unified Pod (FOUP), which has a box body 10 and a door body 20. There are a plurality of slots 11 inside the box body 10 to accommodate a plurality of pods horizontally. Wafer, and an opening 12 is provided on one side of the box body 10 for carrying o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/673
Inventor 吕保义林志铭潘冠纶
Owner GUDENG PRECISION IND CO LTD
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