Mould for shaping mobile phone light guide panel and technology for preparing mobile phone light guide panel

Abstract

The invention belongs to the injection mould field and provides a mould for shaping a mobile phone light guide panel. The mould comprises a first injection mould used for shaping a PC board and a second injection mould used for shaping silicone keypad bases on the PC board, wherein raised adhesive-pressing lines are arranged on the periphery of cavities which are used for shaping the silicone keypad bases and arranged on a front mould core of the second injection mould, and a back mould core of the second injection mould is provided with a material cutting groove. The invention also provides a technology for preparing the mobile phone light guide panel. Compared with the prior art, the invention adopts a special structure, namely the adhesive-pressing lines; when the silicone keypad basesare shaped on the PC board, the adhesive can not overflow on the periphery of the mobile phone light guide panel and near the silicone keypad bases and inner bores, thus avoiding the process of removing excessive adhesive manually, greatly increasing the production efficiency and lowering the production cost; and the invention adopts the structure of the material cutting groove, thus avoiding thephenomenon of air trapping in the cavity of the mould, ensuring the appearance quality of the product, reducing the reject ratio and increasing the product quality.

Description

technical field [0001] The invention belongs to the field of injection molds, and in particular relates to a mold for forming a mobile phone light guide plate and a process for manufacturing the mobile phone light guide plate. Background technique [0002] With the development of the mobile phone industry, the life cycle of mobile phones has been shortened sharply, and the market demand and types of mobile phone products are increasing day by day, followed by a large demand for mobile phone buttons. The structure of PC board + silicone button base, the PC board is easy to manufacture with ordinary injection molds. Glue overflow often occurs around the light guide plate, the base of the silicone button and the inner hole during the seat. These overflow glue needs to be removed manually, which seriously affects the production efficiency of the light guide plate of the mobile phone and increases the production cost. Contents of the invention [0003] The purpose of the prese...

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Problems solved by technology

[0003] The purpose of the present invention is to provide a mold for forming a mobile phone light guide plate, aiming at solving the problem that the surrounding area of ​​the mobile phone light guide plate, the silicone key base and the inner hole are often overflowed and need to be manually removed when the silicone keypad base is formed on the PC board. question

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