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Mould for shaping mobile phone light guide panel and technology for preparing mobile phone light guide panel

A technology for light guide plates and mobile phones, which is applied to optical components, household appliances, and other household appliances. It can solve problems such as glue overflow and manual removal, and achieve the effects of improving production efficiency and reducing production costs.

Inactive Publication Date: 2013-08-07
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to provide a mold for forming a mobile phone light guide plate, aiming at solving the problem that the surrounding area of ​​the mobile phone light guide plate, the silicone key base and the inner hole are often overflowed and need to be manually removed when the silicone keypad base is formed on the PC board. question

Method used

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  • Mould for shaping mobile phone light guide panel and technology for preparing mobile phone light guide panel
  • Mould for shaping mobile phone light guide panel and technology for preparing mobile phone light guide panel
  • Mould for shaping mobile phone light guide panel and technology for preparing mobile phone light guide panel

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Embodiment Construction

[0023] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0024] refer to Figure 1 to Figure 11 As shown, a mold for forming a mobile phone light guide plate 1 provided by an embodiment of the present invention includes a first injection mold 2 for forming a PC board 11 and a second injection mold for forming a silicone key base 12 on the PC board 11. Mold 3, the first injection mold 2 includes a first front mold core 21 and a first rear mold core 22, and the first front mold core 21 and the first rear mold core 22 cooperate to form the first mold core for molding the PC board 11 A mold cavity (not shown in the figure) and a first runner cavity (not sho...

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Abstract

Disclosed are a molding system for forming a light guide plate (1) having a PC board (11) and a keypad base (12) formed thereon. The molding system comprises at least a first injection mold (2) each having a first injection mold cavity for forming the PC board (11); and at least a second injection mold (3) each having a second injection mold cavity (33) for forming the keypad base(12). Plastic blocking members (311) may be provided along periphery of the second mold cavity (33) on a parting surface of the second injection mold (3). Further, a method for forming a light guide plate (1) using the molding system as described above is also disclosed. Based on the present invention, overflow of injected material is eliminated, thus avoiding manual removal of the overflowed material from the final product.

Description

technical field [0001] The invention belongs to the field of injection molds, and in particular relates to a mold for forming a mobile phone light guide plate and a process for manufacturing the mobile phone light guide plate. Background technique [0002] With the development of the mobile phone industry, the life cycle of mobile phones has been shortened sharply, and the market demand and types of mobile phone products are increasing day by day, followed by a large demand for mobile phone buttons. The structure of PC board + silicone button base, the PC board is easy to manufacture with ordinary injection molds. Glue overflow often occurs around the light guide plate, the base of the silicone button and the inner hole during the seat. These overflow glue needs to be removed manually, which seriously affects the production efficiency of the light guide plate of the mobile phone and increases the production cost. Contents of the invention [0003] The purpose of the prese...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C45/26B29C45/78B29C45/00B29C45/14B29C71/02B29L11/00B29K83/00B29K69/00
CPCB29C2045/1687B29C45/2608B29K2283/00B29L2031/466B29C45/1676
Inventor 张雪峰
Owner BYD CO LTD
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