Precise and fine circuit binding force improving device and manufacturing method thereof
A technology of fine lines and manufacturing methods, applied in the improvement of metal adhesion of insulating substrates, secondary processing of printed circuits, etc., can solve problems such as uneven roughening and limited roughening degree, and achieve improved surface adhesion and savings. Process costs and the effect of improving product yield
Active Publication Date: 2012-06-06
NAN YA PRINTED CIRCUIT BOARD CORPORATION
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Problems solved by technology
[0004] However, in the known surface roughening treatment, it is necessary to select a suitable roughening method according to different insulating layer materials, and the degree of roughening is limited by the condition parameters set by the process itself. Therefore, in order to cope with the process of fine lines, it is necessary to improve the current roughening process
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[0024] The manufacturing method of the device for improving the bonding force of fine circuits according to the embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that these drawings are all simplified schematic diagrams to emphasize the features of the present invention, so the dimensions of the components in the drawings are not completely drawn to actual scale. And the embodiments of the present invention may also include components not shown in the figure.
[0025] see Figure 1 to Figure 3 , the first embodiment of the method of manufacturing the device for improving the bonding force of fine lines in the present invention will be described in detail. see figure 1 , first provide a circuit substrate 100 with the inner layer circuit completed, the circuit substrate 100 has a patterned copper layer 110, and a via hole 120, wherein the core material of the circuit substrate 100 includes pa...
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The invention relates to a precise and fine circuit binding force improving binding force device and a manufacturing method thereof. The method comprises the following steps: providing a circuit substrate with a complete inner circuit, wherein a patterning copper layer is arranged on the circuit substrate; correspondingly, forming a viscous resin on the patterning copper layer; and coating a dielectric layer on the viscous resin. In the precise and fine circuit binding force improving binding force device, the viscous resin substitutes the known roughening method, so the method of the invention can completely substitute the known copper surface roughening or dielectric layer roughening process, can save the cost for the surface roughening process, can reduce the undesirable binding effectbecause of different materials, increases surface binding force and then improves yield of the product.
Description
technical field [0001] The invention relates to a bonding force improving device and a manufacturing method thereof, in particular to a fine circuit bonding force improving device and a manufacturing method thereof. Background technique [0002] In recent years, with the continuous pursuit of light, thin, short and small electronic products, the printed circuit board (PCB) has gradually developed towards high density. In order to meet this trend, the circuit pattern of the printed circuit board needs to be more refined and high density. [0003] In the current circuit forming technology, the surface of the insulating layer is roughened (such as soaking in an oxidant) to make the surface of the insulating layer have a certain roughness, and then the desired circuit is formed on the insulating layer by an image transfer process. In recent years, the lines have been developed to fine lines (line width / line spacing below 15 / 15μm). When the surface roughness of the insulating la...
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IPC IPC(8): H05K3/38
Inventor 赖学翰林贤杰江国春何信芳
Owner NAN YA PRINTED CIRCUIT BOARD CORPORATION