NOR type flash memory structure with double ion implantation and manufacturing method thereof
An ion implantation and manufacturing method technology, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve the problems of serious electrical connection, affecting the carrier mobility in flash memory, etc. Stable effect of write and scrub programs
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[0053] In order to fully understand the purpose, features and effects of the present invention, the present invention will be described in detail through the following specific embodiments and accompanying drawings, which will be described later. In these different drawings and embodiments, the same components will use the same symbols.
[0054] First refer to figure 1, is a partial cross-sectional view of the flash memory structure of the present invention. The figure shows that two gate structures 102 are formed on a semiconductor substrate 100, and these gate structures 102 respectively include: a tunneling oxide layer 102a (tunneling oxide layer), a floating gate 102b (floating gate), a dielectric layer 102c, A control gate 102d (control gate) forms a channel 103 . The material of the semiconductor substrate 100 can be silicon, silicon germanium (SiGe), silicon on insulator (SOI), silicon germanium on insulator (SGOI), germanium on insulator (germanium) on insulator, G...
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