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Contacting devices for power semiconductor modules

A technology for power semiconductors and contact devices, which is applied to semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., and can solve problems such as power semiconductor modules stopping operation.

Inactive Publication Date: 2016-03-30
SEMIKRON ELECTRONICS GMBH & CO KG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result of this relative movement, in particular after prolonged continuous use or service life of the power semiconductor module, undesired material loss can occur on the contact-conducting end section of the elastic contact element and / or on the connection element of the power semiconductor module, In extreme cases, this material loss can even lead to a shutdown of the power semiconductor modules

Method used

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  • Contacting devices for power semiconductor modules
  • Contacting devices for power semiconductor modules
  • Contacting devices for power semiconductor modules

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] figure 1 A chip component 10 with a quadrangular base is shown in perspective. A chip component 10 made of electrically conductive material is arranged on a planar circuit carrier 12 in order to produce a contact connection with a connection element 14 .

[0027] The flat circuit carrier 12 can be, for example, a substrate (DCB) made of aluminum oxide or a printed circuit board (PCB).

[0028] The chip component 10 is designed with a centering recess 16 for a contact-conducting end section 18 of the spring contact element. Respectively figure 2 and 3 Such a contact-conducting end section 18 is illustrated in thin lines. The respective contacting end section 18 can advantageously be formed in a simple straight line in the form of a pin, so that the contacting end section 18 is projected onto the associated connection element of the flat circuit carrier 12 . 14 requires only a small projected area (ie base area), and the associated chip component 10 can also be dime...

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PUM

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Abstract

The device has an elastic contact element comprising a contacting-end section (18) that is provided for connection with a connection element (14) of an interconnect device (12) e.g. substrate made from aluminum oxide, of a power semiconductor module, where the connection element has a chip component (10) with a centering recess (16) for the end section. The chip component is designed as an automatic surface mounted device-assembled component and completely made from metal, where the chip component is provided with an electro-plating (20).

Description

technical field [0001] The invention relates to a contacting device for a power semiconductor module, having a resilient contact element with a contacting end section provided for connection to a power semiconductor module Component contact conduction. Background technique [0002] A power semiconductor module is known from DE 10 2005 055 713 A1, which can have elastic contact elements in the form of cylindrical springs. Each cylindrical spring is formed with a linear, pin-shaped contacting end section, which is provided for contacting a connection element of the known power semiconductor module. Pass. A corresponding connection element can be a contact area of ​​a power semiconductor component or a contact area of ​​a conductor track of a substrate of a power semiconductor module. [0003] A contacting device for power semiconductor modules and disk thyristors is known from DE 10 2004 050 588 A1. This known contact device has a resilient contact element, which can be fo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/48H01L25/07
CPCH05K3/4015H01L23/48H01L2924/0002H05K3/325H05K2201/0311H05K2201/09745H05K2201/1025
Inventor 彼得·莫尔
Owner SEMIKRON ELECTRONICS GMBH & CO KG