Sealing adhesive and preparation method thereof

A technology of sealing adhesives and accelerators, applied in adhesives, chemical instruments and methods, modified epoxy resin adhesives, etc., can solve problems such as waste, harmful odor, and curing failure

Inactive Publication Date: 2010-12-15
陈玉梅
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The static shear strength after steel / steel bonding can reach 24Mpa, and the peel strength is 1.2Mpa. At present, the acrylic adhesive used for metal is two-component, which needs to be prepared every time. Parts are quickly cured and invalidated, resulting in waste, and there is a strong smell that is harmful to people

Method used

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  • Sealing adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Embodiment 1, prepare raw material by following formula:

[0046] Ethoxylated bisphenol A dimethacrylate 30 kg;

[0047] Modified E-44 epoxy resin 18 kg;

[0048] Lauryl acrylate 3 kg;

[0049] 55 kg of triethylene glycol dimethacrylate;

[0050] Initiator 1 kg;

[0051] Stabilizer 0.01 kg;

[0052] Accelerator 1 kg;

[0053]Accelerator 2 kg;

[0054] Metal chelating agent 0.1 kg;

[0055] Filling 4 kg.

[0056] Among the raw materials prepared above, except for the accelerator, mix the rest of the raw materials together, heat up, stir at a temperature of 55-70°C for 3-5 hours to completely dissolve the solids, and then cool down to cool down at 40°C. Add the accelerator at a temperature of ~50°C and stir evenly.

[0057] Wherein, the preparation process of modified E-44 epoxy resin is: 40~80 parts by weight of E-44 epoxy resin, 20~50 parts by weight of methacrylic acid, 1~2 parts by weight of p-phenol methyl ether are mixed together, Heating to raise the temp...

Embodiment 2

[0061] Embodiment 2, prepare raw material by following formula:

[0062] 40 kg of ethoxylated bisphenol A dimethacrylate;

[0063] Modified E-44 epoxy resin 10 kg;

[0064] Lauryl acrylate 5 kg;

[0065] 35 kg of triethylene glycol dimethacrylate;

[0066] Initiator 1.5 kg;

[0067] Stabilizer 0.04 kg;

[0068] Accelerator 3 kg;

[0069] Accelerator 5 kg;

[0070] Metal chelating agent 1.5 kg;

[0071] Filling 4.5 kg.

[0072] Among the raw materials prepared above, except for the accelerator, mix the rest of the raw materials together, heat up, stir at a temperature of 55-70°C for 3-5 hours to completely dissolve the solids, and then cool down to cool down at 40°C. Add the accelerator at a temperature of ~50°C and stir evenly.

[0073] Wherein, the preparation process of modified E-44 epoxy resin is: 40~80 parts by weight of E-44 epoxy resin, 20~50 parts by weight of methacrylic acid, 1~2 parts by weight of p-phenol methyl ether are mixed together, Heating to raise ...

Embodiment 3

[0077] Embodiment 3, prepare raw material by following formula:

[0078] Ethoxylated bisphenol A dimethacrylate 20 kg;

[0079] Modified E-44 epoxy resin 20 kg;

[0080] Lauryl acrylate 0.5 kg;

[0081] 60 kg of triethylene glycol dimethacrylate;

[0082] 5 kg of phenolic resin;

[0083] Initiator 5 kg;

[0084] Stabilizer 0.05 kg;

[0085] Accelerator 4 kg;

[0086] Accelerator 0.1 kg;

[0087] Metal chelating agent 0.5 kg;

[0088] Filling 6 kg.

[0089] Among the raw materials prepared above, except for the accelerator, mix the rest of the raw materials together, heat up, stir at a temperature of 55-70°C for 3-5 hours to completely dissolve the solids, and then cool down to cool down at 40°C. Add the accelerator at a temperature of ~50°C and stir evenly.

[0090] Wherein, the preparation process of modified E-44 epoxy resin is: 40~80 parts by weight of E-44 epoxy resin, 20~50 parts by weight of methacrylic acid, 1~2 parts by weight of p-phenol methyl ether are mix...

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Abstract

The invention provides a sealing adhesive and a preparation method thereof. The sealing adhesive is prepared from in parts by weight: 20-40 parts of ethoxylated bisphenol A dimethacrylate, 5-20 parts of modified E-44 epoxy resin, 0.2-5 parts of lauryl acrylate, 30-60 parts of triethylene glycol dimethacrylate, 1-5 parts of initiator, 0.001-0.05 part of stabilizing agent, 0.5-4 parts of accelerator, 0.02-5 parts of secondary accelerator, 0.05-1.5 parts of metal chelating agent and 4-6 parts of filler. The preparation method comprises the following steps of: except the accelerator, mixing other raw materials and heating to raise the temperature; stirring at the temperature of 55-70DEG C for 3-5 hours to completely dissolve the solid; and then cooling to reduce the temperature, adding the accelerator at the temperature of 40-50DEG C and uniformly stirring to obtain the sealing adhesive. The sealing adhesive maintains all advantages of acrylate resin adhesives and remarkably improves the toughness, the torque value, medium resistance and low temperature resistance.

Description

technical field [0001] The invention belongs to the technical field of chemical products and preparation techniques, and in particular relates to a sealing adhesive and a preparation method thereof. Background technique [0002] Sealant adhesive, referred to as sealant for short, is a multi-purpose functional material with both bonding and sealing properties. It can not only prevent internal gas or liquid leakage, but also prevent external dust, moisture, water, dirt and chemicals from intruding, and can prevent mechanical vibration, impact damage or achieve the effect of sound insulation and heat insulation. [0003] For some special products, such as shells, ships, military vehicles, etc., there are higher requirements for the quality of sealing adhesives. It is required that the sealing adhesive has very good resistance to various chemical media; it must have stable chemical properties and explosive stability; it must have strong tensile strength and breaking torque valu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/02C09J163/10C09K3/10C08G59/17
Inventor 陈玉梅余勇陈茂直
Owner 陈玉梅
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