Sealing adhesive and preparation method thereof
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Embodiment 1
[0045] Embodiment 1, prepare raw material by following formula:
[0046] Ethoxylated bisphenol A dimethacrylate 30 kg;
[0047] Modified E-44 epoxy resin 18 kg;
[0048] Lauryl acrylate 3 kg;
[0049] 55 kg of triethylene glycol dimethacrylate;
[0050] Initiator 1 kg;
[0051] Stabilizer 0.01 kg;
[0052] Accelerator 1 kg;
[0053]Accelerator 2 kg;
[0054] Metal chelating agent 0.1 kg;
[0055] Filling 4 kg.
[0056] Among the raw materials prepared above, except for the accelerator, mix the rest of the raw materials together, heat up, stir at a temperature of 55-70°C for 3-5 hours to completely dissolve the solids, and then cool down to cool down at 40°C. Add the accelerator at a temperature of ~50°C and stir evenly.
[0057] Wherein, the preparation process of modified E-44 epoxy resin is: 40~80 parts by weight of E-44 epoxy resin, 20~50 parts by weight of methacrylic acid, 1~2 parts by weight of p-phenol methyl ether are mixed together, Heating to raise the temp...
Embodiment 2
[0061] Embodiment 2, prepare raw material by following formula:
[0062] 40 kg of ethoxylated bisphenol A dimethacrylate;
[0063] Modified E-44 epoxy resin 10 kg;
[0064] Lauryl acrylate 5 kg;
[0065] 35 kg of triethylene glycol dimethacrylate;
[0066] Initiator 1.5 kg;
[0067] Stabilizer 0.04 kg;
[0068] Accelerator 3 kg;
[0069] Accelerator 5 kg;
[0070] Metal chelating agent 1.5 kg;
[0071] Filling 4.5 kg.
[0072] Among the raw materials prepared above, except for the accelerator, mix the rest of the raw materials together, heat up, stir at a temperature of 55-70°C for 3-5 hours to completely dissolve the solids, and then cool down to cool down at 40°C. Add the accelerator at a temperature of ~50°C and stir evenly.
[0073] Wherein, the preparation process of modified E-44 epoxy resin is: 40~80 parts by weight of E-44 epoxy resin, 20~50 parts by weight of methacrylic acid, 1~2 parts by weight of p-phenol methyl ether are mixed together, Heating to raise ...
Embodiment 3
[0077] Embodiment 3, prepare raw material by following formula:
[0078] Ethoxylated bisphenol A dimethacrylate 20 kg;
[0079] Modified E-44 epoxy resin 20 kg;
[0080] Lauryl acrylate 0.5 kg;
[0081] 60 kg of triethylene glycol dimethacrylate;
[0082] 5 kg of phenolic resin;
[0083] Initiator 5 kg;
[0084] Stabilizer 0.05 kg;
[0085] Accelerator 4 kg;
[0086] Accelerator 0.1 kg;
[0087] Metal chelating agent 0.5 kg;
[0088] Filling 6 kg.
[0089] Among the raw materials prepared above, except for the accelerator, mix the rest of the raw materials together, heat up, stir at a temperature of 55-70°C for 3-5 hours to completely dissolve the solids, and then cool down to cool down at 40°C. Add the accelerator at a temperature of ~50°C and stir evenly.
[0090] Wherein, the preparation process of modified E-44 epoxy resin is: 40~80 parts by weight of E-44 epoxy resin, 20~50 parts by weight of methacrylic acid, 1~2 parts by weight of p-phenol methyl ether are mix...
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