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Multi-functional communication module

A communication module and multi-functional technology, applied in telephone communication, transmission systems, instruments, etc., can solve problems such as improving the motherboard, affecting the operating efficiency of the motherboard, and reducing the efficiency of wireless signal transmission by multiple antennas

Inactive Publication Date: 2011-01-26
纮华电子科技(上海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this design mechanism will reduce the efficiency of multiple antennas for transmitting wireless signals
In addition, the heat generated by multiple wireless communication components will increase the temperature of the motherboard and reduce the heat dissipation efficiency of the motherboard cooling module, thereby affecting the operating performance of the motherboard

Method used

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Examples

Experimental program
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Embodiment Construction

[0021] see figure 1 , figure 1 It is a schematic diagram of an electronic device 10 according to a preferred embodiment of the present invention. The electronic device 10 can be a notebook computer, and the electronic device 10 includes a display screen 12 and a host 14 . A motherboard 141 is installed inside the host 14 , and the display screen 12 is connected to the host 14 and can be used to display image data. see figure 2 , figure 2 It is a schematic diagram of installing the multifunctional communication module 20 into the electronic device 10 according to a preferred embodiment of the present invention. First introduce the structure of the display screen 12 of the electronic device 10, such as figure 2 As shown, the display screen 12 includes a housing 121 and a display panel 123 . The display panel 123 is disposed inside the casing 121 and can be used to display image data. The display screen 12 further includes a heat sink 125 disposed between the housing 12...

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Abstract

A multi-functional communication module includes a base, a plurality of wireless communication elements disposed on the base, a plurality of antennas electrically connected to the plurality of wireless communication elements respectively so as to transmit wireless signals of the plurality of wireless communication elements, and a heat conductive component. A side of the heat conductive component is connected to the plurality of wireless communication elements so as to dissipate heat generated by the plurality of wireless communication elements.

Description

technical field [0001] The invention relates to a communication module, in particular to a multifunctional communication module integrating multiple wireless communication components. Background technique [0002] In a traditional notebook computer, multiple wireless communication components are installed on the main board of the host, and multiple antennas are installed on the side of the display screen of the display module, and then the multiple wireless communication components and antennas are electrically connected to each other by transmission lines, so as to Electronic signals are transmitted between the two, so a large space is required in the host and the display module to accommodate multiple sets of transmission lines. However, multiple sets of transmission lines will cause complicated wiring between the host computer and the display module. And the two ends of the transmission line are respectively electrically connected to the wireless communication element se...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04B1/00G06F1/16
CPCH04M1/0266H01L2224/48091H01L2924/00014
Inventor 杨承绪
Owner 纮华电子科技(上海)有限公司